HomePress ReleaseBTU Releases the Next-Generation Reflow Oven Platform – Aurora

    BTU Releases the Next-Generation Reflow Oven Platform – Aurora

    NORTH BILLERICA BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, announced the release of its newest reflow oven platform. Aurora is leading the way to the factory of the future by seeing reflow in a new light.

    Aurora, the newest reflow oven platform, is designed based on years of expertise and leadership from BTU, the makers of the industry’s best performing reflow ovens. As the latest in a long line of world-class thermal systems, Aurora has quality and innovation in its DNA.

    “It has always been the goal of BTU International to enable our customer’s success – and we’ve packed this new reflow oven platform with features that maximize thermal performance and productivity while decreasing maintenance and running costs,” said Rob DiMatteo, general manager of BTU International.  “The Aurora was designed based on our many decades of experience in reflow with an eye to the future.”

    Aurora systems feature a modern, fully updated user interface, integrated Aqua Scrub™ flux management technology, innovative Smart Power energy savings software, and advanced process control technologies.  Aurora’s combination of superior thermal performance, process flexibility, and vision for the future sets the new standard for reflow ovens today – and for tomorrow.

    This new reflow oven platform features the industry’s first factory configurable heating and cooling architecture providing the flexibility to customize your reflow oven for specific product/process characteristics including very heavy boards, slow cooling requirements, or increased throughput. In addition, the Aurora reflow platform features BTU’s exclusive closed-loop convection control technology that has been shown to maintain thermal performance even at significantly increased belt speeds, providing greater productivity, efficiency and throughput.

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