Semiconductors and Chips

    Molecular Beam Epitaxy (MBE) Growth of GaAs-Based Devices

    Courtesy: Orbit & Skyline In the semiconductor ecosystem, we are familiar with the chips that go into our devices. Of course, they do not start...

    Adapting Foundation IP to Exceed 2 nm Power Efficiency in Next-Gen Hyperscale Compute Engines

    Courtesy: Synopsys Competing in the booming data centre chip market often comes down to one factor: power efficiency. The less power a CPU, GPU, or...

    TI’s vast automotive portfolio: Shift towards autonomous vehicles

    Texas Instruments (TI) has introduced new automotive semiconductors and development resources to enhance safety and autonomy across vehicle models. TI’s scalable TDA5 high-performance computing...

    How 2025’s Constraints Became the Blueprint for Electronics System Design in 2026?

    As the electronics industry looks back at 2025, a clear shift toward efficiency, miniaturisation, and—most critically—more deliberate material choices becomes evident. The year stands...

    Predictions and Trends in Semicon Manufacturing for 2026

    Digital identity technologies like near-field communication (NFC), along with AI and Agentic AI tools for automation, improved efficiency, and accelerated innovation, will be the...

    Innovation led through ROHM & Tata Electronics’ Strategic Partnership in Semicon Business

    ROHM and Tata Electronics announced their strategic partnership for semiconductor manufacturing in India for both the Indian and global markets. The partnership aims to...

    NEHU’s indigenous chip against Red Spider Mite for tea gardens

    The North-Eastern Hill University (NEHU) in Meghalaya, developed an innovative indigenous semiconductor chip aimed at repelling the Red Spider Mite, one of the most...

    India’s Semicon Programme: From Design to Packaging

    Union Minister of State for Electronics and Information Technology Shri Jitin Prasada, stated India’s achievements from the Semicon India Programme. The Indian Government launched...

    FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals

    CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...

    As Energy-Efficient Chips Are Rising — HCLTech × Dolphin’s New Partnership Gives the Trend a...

    Amid the ongoing push, HCLTech & Dolphin Semiconductors have announced a strategic partnership aiming to develop energy-efficient chips for IoT and data centre applications....

    Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

    Courtesy: Lam Research As advanced logic chips decrease in size, voltage loss can increase An emerging solution is backside power delivery networks that use...

    CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

    CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...

    Beyond the Bill: How AI-Enabled Smart Meters Are Driving Lead Time Optimization and Supply Chain...

    Introduction Smart meters have significantly evolved since their initial implementation for consumer billing. In the contemporary networked industrial landscape, where semiconductor fabrication facilities, data centers,...

    Inside the Digital Twin: How AI is Building Virtual Fabs to Prevent Trillion-Dollar Mistakes

    Introduction Semiconductor manufacturing often feels like modern alchemy: billions of tiny transistors squeezed onto a chip smaller than a fingernail, stitched through thousands of precise...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home...

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