Semiconductors and Chips

    FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals

    CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...

    As Energy-Efficient Chips Are Rising — HCLTech × Dolphin’s New Partnership Gives the Trend a...

    Amid the ongoing push, HCLTech & Dolphin Semiconductors have announced a strategic partnership aiming to develop energy-efficient chips for IoT and data centre applications....

    Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

    Courtesy: Lam Research As advanced logic chips decrease in size, voltage loss can increase An emerging solution is backside power delivery networks that use...

    CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

    CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...

    Beyond the Bill: How AI-Enabled Smart Meters Are Driving Lead Time Optimization and Supply Chain...

    Introduction Smart meters have significantly evolved since their initial implementation for consumer billing. In the contemporary networked industrial landscape, where semiconductor fabrication facilities, data centers,...

    Inside the Digital Twin: How AI is Building Virtual Fabs to Prevent Trillion-Dollar Mistakes

    Introduction Semiconductor manufacturing often feels like modern alchemy: billions of tiny transistors squeezed onto a chip smaller than a fingernail, stitched through thousands of precise...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship cutting edge Power Semiconductor Devices and technology to the Indian market. MEI Participation in PCIM...

    Overcoming BEOL Patterning Challenges at the 3-NM Node

    Courtesy: Lam Research ● Controlling critical process parameters is key to managing edge placement error (EPE) ● Simulations revealed that only 9.75% of runs met the...

    7 Challenges Facing Fab Operations and How Providers Can Solve Them

    Courtesy: Monikantan Ayyasamy, General Manager, Equipment Engineering & Supply Chain Management at Orbit & Skyline Semiconductor manufacturing facilities, or fabs, are some of the most...

    Caliber Interconnects Accelerates Complex Chiplet and ATE Hardware Design with Cadence Allegro X and Sigrity X Solutions

    Caliber Interconnects Pvt. Ltd., announced that it has achieved accelerated turnaround times and first-time-right outcomes for complex chiplet and Automated Test Equipment (ATE) hardware...

    Infineon’s new MOTIX system-on-chip family for motor control enables compact and cost-efficient designs

    Infineon Technologies is expanding its MOTIX 32-bit motor control SoC (System-on-chip) family with new solutions for both brushed (BDC) and brushless (BLDC) motor applications:...

    From Monoliths to Modules: A story of heterogeneous integration, chiplets, and the industry reshaping itself

    For nearly four decades, the semiconductor narrative has simply revolved around Moore’s Law, shrinking transistors, packing more logic onto a single die for achieving...

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management chips to help companies meet growing artificial intelligence (AI) computing demands and scale power-management architectures...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth, low latency and advanced security for high-performance compute, cloud computing and hyperscale data centers As artificial...

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