Semiconductors and Chips

Cadence and NVIDIA Collaborate on Accelerated Engineering Solutions for Agentic AI Chip and System Design​

Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI...

Renesas Launches First Bidirectional 650V-Class GaN Switch For Multiple Uses

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, unveiled the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking...

Thermal Management in 3D-IC: Modelling Hotspots, Materials, & Cooling Strategies

Courtesy: Cadence As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted...

CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialise NcodiN’s optical interposer technology on a 300...

NXP CoreRide Puts Automakers on Fast Path to 48 V Scalable Zonal Architectures

NXP Semiconductors introduced its NXP CoreRide Z248 zonal reference system - the semiconductor industry’s first pre-validated, design-ready zonal foundation that combines advanced 48 V...

Designing LIDAR on a Chip: A Multiphysics Simulation Workflow for Integrated Photonics

Courtesy: Keysight Introduction LIDAR (Light Detection and Ranging) has become a cornerstone technology for autonomous vehicles, enabling high-resolution spatial mapping and object detection. As the industry...

From 10 to 1000 TOPS: Why Automotive Chips Need a New Architecture

Speaking at the Auto EV Tech Vision Summit 2025, Namrta Sharma, Technical Director at Aritrak Technologies, highlighted how chiplet architectures are emerging as a...

New LX4580 – Highly Integrated 24‑Channel Mixed‑Signal IC for Aviation & Defence Actuation Systems

Microchip Technology announces the LX4580, a 24‑channel mixed‑signal IC designed to streamline high‑reliability actuation control systems for aviation and defence applications. The LX4580 is highly...

Top Seven Tech Trends in the semiconductor sector for 2026

By: STMicroelectronics In 2026, a new class of intelligent machines will emerge. Several of the trends we’ve identified are natural extensions of those we highlighted...

The Rise of the AgentEngineer: How AI is Orchestrating the Future of Chip Design

While traditional Electronic Design Automation tools have been faithfully executing commands for decades, today's agentic AI systems are rewriting the rulebook by thinking, iterating,...

Manufacturing Breakthroughs in Chip Packaging Are Powering AI’s Future

Courtesy: Lam Research With all the attention being given to AI, it’s easy to overlook some of the core technologies enabling its capabilities. Sure, a...

3 semicon-enabled innovations impacting our experience of the world

Courtesy: Texas Instruments The chips that power today's smartphones contain over 15 billion transistors; the semiconductors powering data centres can have hundreds of billions of...

Silicon Shield: Role of Semiconductors in Modern Warfare

Courtesy: Orbit & Skyline War has always been part of human history, and true global peace still seems far away. While modern wars may look...

Edge AI Chipsets: How On-Device Intelligence Is Reshaping Embedded System Design

The cloud-first model for embedded systems is becoming a legacy architecture. We’re moving away from simply piping data to remote servers and instead shifting...

Molecular Beam Epitaxy (MBE) Growth of GaAs-Based Devices

Courtesy: Orbit & Skyline In the semiconductor ecosystem, we are familiar with the chips that go into our devices. Of course, they do not start...

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