Packaging

Packaging

onsemi Unveils Advanced Semiconductor Packaging to Improve EV Inverter Efficiency

ELE Times Research Desk -
​Semiconductor manufacturer onsemi, specialised in silicon carbide (SiC) power solutions, power management, and CMOS image sensors has introduced its Embedded Power Platform—a wafer-level power...
Analog

Murata Begins Mass Production of World’s Smallest 0201-Inch Three-Terminal Low-ESL MLCCs

ELE Times Research Desk -
Murata Manufacturing, a Japanese global leader in electronic components and communication modules has begun mass production of the LLD series, the world’s smallest line...
Analog

SEMICON India 2026 Concludes at Yashobhoomi, Showcasing India’s Growing Semiconductor Ecosystem

ELE Times Research Desk -
SEMICON India 2026, the fifth edition of India’s flagship semiconductor conference, concluded on September 19 at Yashobhoomi, New Delhi, highlighting the country’s growing capabilities...
Electronics

India Targets 40% Domestic Value Addition in Electronics Manufacturing

ELE Times Research Desk -
India continues to focus on raising domestic value addition and further deepening domestic manufacturing in electronics industry. Moving beyond large-scale assembly towards deeper manufacturing...
Analog

Renesas Introduces Smallest GreenPAK Configurable Mixed-Signal IC with Multi-Time Programmability

ELE Times Research Desk -
Renesas Electronics Corporation on 24th September, 2026, announced the SLG46801, the industry's smallest GreenPAK configurable mixed-signal device, available in both WLCSP and STQFN packages....
Electronics

Tata Electronics Signs Seven MoUs to Strengthen India’s Semiconductor Value Chain

ELE Times Research Desk -
​To strengthen India’s semiconductor manufacturing ecosystem across different stages of the value chain, Tata Electronics signed seven Memorandums of Understanding (MoUs) with global companies...
Electronics

India’s Chips to Go Global as ISM 2.0 Targets 200 Chip-Design Companies

ELE Times Research Desk -
​Semicon 2.0 is the next phase of India Semiconductor Mission (ISM) approved by the Union Cabinet with the primary goal of expanding domestic chip...
Automotive

INFAC Develops 800V-to-48V Power Conversion Technology to Targets Higher EV Efficiency

ELE Times Research Desk -
South Korea's INFAC Corporation has introduced a new 800V battery pack design block for electric vehicles that integrates an 800V-to-48V high-power isolated and regulated...
Electronics

How 2025’s Constraints Became the Blueprint for Electronics System Design in 2026?

Kumar Harshit -
As the electronics industry looks back at 2025, a clear shift toward efficiency, miniaturisation, and—most critically—more deliberate material choices becomes evident. The year stands...
News

FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals

ELE Times News -
CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...
News

CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

ELE Times News -
CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...
Editor's Choice

BoardSurfers: Leveraging Object Hierarchy for Effective Constraint Management

ELE Times Report -
Courtesy: Cadence Systems Allegro X Constraint Manager provides a worksheet-based environment where you define and manage constraints for all the objects in your design. In large, complex...
Electronics

RECOM introduces wide-input 30W DC/DC in a miniature package

ELE Times Research Desk -
Packing a 30W rating into a 25.4mm x 25.4mm low-profile case, the new cost-effective REC30E-Z series of DC/DC converters from RECOM also boasts two...
News

OMRON to Continue its Strong Focus towards Indian Packaging Machine Makers with Innovative- Automation...

ELE Times News -
Reiterating its commitment towards its vision of “Enriching the Future for People, Industries and the Globe by innovative-Automation”, OMRON is on its way to...
Interviews

Endless Possibilities with Next Generation of Wearable Technology

Mayank Vashisht -
Integrating Machines and technology with the human body in one way or the other has always been a very significant thing to chase for...
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TME

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