dSPACE India 2026 Conference Highlights AI, ECU Cybersecurity and HIL Testing

More than 500 participants explore integrated workflows for AI...

DRDO Successfully Tests Indigenous High-Altitude Surveillance Platform

Stratospheric platform attains 21 km altitude during test to...

BAE Systems Unveils High-Power Microwave and Advanced Artillery Defence Systems

New directed-energy and kinetic technologies will aim to drone...

Raytheon Advances Coyote Interceptor to Counter Emerging Drone Threats

New rocket-motor, seeker and warhead upgrades set to boost...

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Powering India’s Growth: Key Companies in the Electrical Infrastructure Value Chain

India’s growing real estate sector and investments in power...

Rohde & Schwarz to Showcase Advanced Test and Measurement Solutions at electronica 2026

At electronica 2026 in Munich, Rohde & Schwarz will...

AI Agent Orchestration Explained: How Frameworks, Memory, Tools and Governance Work Together

Abhishek Pandey ELE Times, Sub-Editor Inside the architecture, platforms and...

Centralised Computing Architectures Are Replacing Traditional ECU-Based Designs: Robert Schweiger, Cadence

The mobility landscape across the globe is undergoing a...

Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computing Development

As spacecraft and satellites become more autonomous and rely on software to perform complex tasks, they need faster and more reliable onboard computing systems. These...

“We’re Redefining Vehicular Security in Software Defined Vehicles” — R.V. Raghu, Director, Versatilist Consulting India

Beyond Physical Perimeters: Transitioning to Attack Surface Management With the...

Infineon to Build Europe’s First High-Volume 300mm GaN Power Semiconductor Manufacturing Facility

Infineon Technologies AG is setting up Europe’s first high-volume...

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Manufacturing News

Infineon to Build Europe’s First High-Volume 300mm GaN Power Semiconductor Manufacturing Facility

Infineon Technologies AG is setting up Europe’s first high-volume...

Elektrobit and Microchip Collaborate on Pre-Integrated AUTOSAR Solutions for Next-Generation Automotive Platforms

Elektrobit, a global expert in automotive software, and Microchip...

Interview | Sanjay Wadhwa, Chairman & Managing Director, NASH Group of Companies

The rapid expansion of AI and its multifaceted applications...

Murata Begins Mass Production of World’s Smallest 0201-Inch Three-Terminal Low-ESL MLCCs

Murata Manufacturing, a Japanese global leader in electronic components...

Infineon Opens New Bangkok Backend Manufacturing Hub to Expand Semiconductor Capacity

Infineon Technologies on 1st of October, 2026 officially inaugurated...

India’s Rs 62,500 Crore Mobile Manufacturing Scheme Targets Next Phase of Electronics Growth

​To deepen domestic manufacturing, scale-up its own supply chain,...

DigiKey Launches Factory Tomorrow Season 6 on AI Infrastructure and Industrial Connectivity

DigiKey, the global distribution leader in electronic components and...

India’s Semiconductor Market Projected to Reach $200 Billion by 2035: EY-IESA Report

​A new analysis report presented by EY-IESA estimates that...

EV Charging in India: Reliability and Interoperability Emerge as Key Challenges

​The demand for electric vehicles is continuously rising in...

Silicon-Carbon Anodes Move Toward EV-Scale Production for Higher Energy Density

As manufactures and battery material companies are searching for...

Design News

Bridging the design-to-deployment gap: How India can lead the next wave of connected device innovation

Hareesh Ramana, Chief Experience Officer, Sasken Group & President,...

EDA Tools for Robust RFICs and Mixed-Signal ICs

Courtesy: Keysight Technologies In radio frequency integrated circuits (RFICs), the...

Inside the Hardware Lab: How Modern Electronic Devices Are Engineered

The engineering of contemporary electronic devices reflects a convergence...

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Artificial Intelligence News

AI Agent Orchestration Explained: How Frameworks, Memory, Tools and Governance Work Together

Abhishek Pandey ELE Times, Sub-Editor Inside the architecture, platforms and...

dSPACE India 2026 Conference Highlights AI, ECU Cybersecurity and HIL Testing

More than 500 participants explore integrated workflows for AI...

Cadence AI Super Agents Help Nokia Accelerate Electronic System Design by 5X

Cadence has announced that Nokia is using its AuraStack...

ASMPT Presents New SOLO Placement Head for AI Server Applications

With its new SOLO placement head, ASMPT SMT Solutions,...

Keysight Introduces PCIe 7.0 Protocol Test Solution to Accelerate AI Infrastructure Validation

Keysight Technologies, Inc. today introduced its Protocol Test Solution...

Infineon at electronica 2026: Technology for the AI Era, From Data Centres Into Robots and Onto the Road

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Microchip Launches LX-820 Radiation-Tolerant Quartz Oscillator for LEO Satellites

Microchip Technology has expanded its L-Series timing product portfolio...

North Korea Tests New Manoeuvrable Missile System

On 22 September 2026, North Korea said it had...

TigerShark Set to Implement F1 Engineering Techniques on Extended-Range Missions.

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