Vishay Intertechnology has introduced a new Automotive Grade, top-side cooling mount thick film power resistor. The Vishay Sfernice D2TO35S is designed for automotive applications, offering improved thermal performance and reduced PCB space requirements. The resistor provides high power dissipation of up to 35 W at 25°C and is housed in a surface-mount TO-263 (D²PAK) package.
As thermal constraints increasingly become the primary system design limitation, many power components are transitioning from PCB-based cooling to top-side cooled architectures. By transferring heat directly to a heatsink, the D2TO35S released today enables up to nine times greater power dissipation than standard PCB-mounted devices when paired with an appropriate heatsink. Its compact, surface-mount design allows designers to increase power dissipation within the same footprint or provide the same functionality in a smaller footprint, while lowering PCB temperatures, reducing thermal stress on neighboring components, and improving overall system reliability.
Offering a non-inductive design for improved signal integrity and power handling in fast transient conditions, the D2TO35S features a resistance range from 4.7 Ω to 550 kΩ — with tolerances down to ± 1 % — thermal resistance of 4.28 °C/W, TCR down to ± 150 ppm/°C, and a wide operating temperature range from -55 °C to +175 °C. The RoHS-compliant device is solder reflow secure at 270 °C/10 s.
