Electronics

STMicroelectronics and Leopard Imaging use NVIDIA Jetson-ready multi-sensor module for robotics vision 

STMicroelectronics and Leopard Imaging have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene-mapping, and...

Graphene in Focus: How Nanotechnology is Transforming Electronics?

As miniaturisation and increasingly complex design architectures continue to define modern technology, nanotechnology is emerging as a frontier discipline shaping the trajectory of innovation—from...

FormFactor and Rohde & Schwarz Advance their Partnership for on-wafer RF Component Characterisation

FormFactor and Rohde & Schwarz have announced a strategic co-marketing partnership as part of FormFactor’s MeasureOne partner program, a solution-integration initiative designed to deliver...

Anritsu and SK Telecom Jointly Verify AI-Based Antenna Optimisation, POSTECH and Bluetest

ANRITSU CORPORATION has jointly verified AI-based antenna optimisation technologies with SK Telecom, South Korea’s leading mobile network operator, Pohang University of Science and Technology...

Cadence and NVIDIA Collaborate on Accelerated Engineering Solutions for Agentic AI Chip and System Design​

Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI...

R&S amplifiers enable high-field immunity testing expansion at IB Lenhardt Lab

IBL Lab GmbH, the DAkkS (Deutsche Akkreditierungsstelle GmbH) accredited EMC test laboratory of IB Lenhardt AG, has significantly expanded its high-field immunity testing capabilities...

Renesas Launches First Bidirectional 650V-Class GaN Switch For Multiple Uses

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, unveiled the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking...

Thermal Management in 3D-IC: Modelling Hotspots, Materials, & Cooling Strategies

Courtesy: Cadence As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted...

Intel Foundry Advances Chip Power Delivery with Next-Generation Capacitor Technology

Courtesy: Intel Highlights Intel and Intel Foundry researchers demonstrated three promising metal-insulator-metal (MIM) materials delivering intrinsic capacitance density up to 98 femtofarads per square micrometre...

Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum transducer, the latest device in the company's PVC4000 series. Designed for cost-effective OEM integration, the...

Impact of AI on Computing and the Criticality of Testing

Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our daily lives, and improving efficiency and decision-making, but its need for computing power is growing...

Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio and FITS-8CH, the suite’s first product. FITS-8CH delivers digital-layer bit error ratio (BER) and forward...

CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialise NcodiN’s optical interposer technology on a 300...

NXP CoreRide Puts Automakers on Fast Path to 48 V Scalable Zonal Architectures

NXP Semiconductors introduced its NXP CoreRide Z248 zonal reference system - the semiconductor industry’s first pre-validated, design-ready zonal foundation that combines advanced 48 V...

Everspin Launches New Generation of Unified Memory for Embedded Systems

Everspin Technologies, a leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, today announced the UNISYST MRAM family, a new generation...

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