Electronics

Designing LIDAR on a Chip: A Multiphysics Simulation Workflow for Integrated Photonics

Courtesy: Keysight Introduction LIDAR (Light Detection and Ranging) has become a cornerstone technology for autonomous vehicles, enabling high-resolution spatial mapping and object detection. As the industry...

From 10 to 1000 TOPS: Why Automotive Chips Need a New Architecture

Speaking at the Auto EV Tech Vision Summit 2025, Namrta Sharma, Technical Director at Aritrak Technologies, highlighted how chiplet architectures are emerging as a...

New LX4580 – Highly Integrated 24‑Channel Mixed‑Signal IC for Aviation & Defence Actuation Systems

Microchip Technology announces the LX4580, a 24‑channel mixed‑signal IC designed to streamline high‑reliability actuation control systems for aviation and defence applications. The LX4580 is highly...

Everspin Advances High-Reliability xSPI MRAM Portfolio With Complete Production Qualification for 64Mb MRAM

Everspin Technologies, the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced continued progress across its high-reliability (HR)...

Differentiating Between LPDDR6, LPDDR5, and LPDDR5X

Courtesy: Synopsys Advances in memory standards are driving faster and more power-efficient mobile and connected devices, from smartphones and tablets to ultra-thin laptops and wearables. One...

R&S Propels 6G Readiness With FR1–FR3 Carrier Demonstration

Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1...

Two Batteries, Two Futures: Why LFP and NMC Are Splitting the EV & Energy Landscape

Batteries have quietly become the limiting factor of modern technology. They define how far an electric vehicle can go, how safely energy can be...

Top Seven Tech Trends in the semiconductor sector for 2026

By: STMicroelectronics In 2026, a new class of intelligent machines will emerge. Several of the trends we’ve identified are natural extensions of those we highlighted...

R&S and Broadcom showcase first Wi-Fi 8 RF signalling tests, paving way for next-gen connectivity

Rohde & Schwarz, in collaboration with Broadcom, is set to display its CMX500 multi-technology multi-channel signalling tester at MWC Barcelona 2026 with newly added...

The Rise of the AgentEngineer: How AI is Orchestrating the Future of Chip Design

While traditional Electronic Design Automation tools have been faithfully executing commands for decades, today's agentic AI systems are rewriting the rulebook by thinking, iterating,...

Manufacturing Breakthroughs in Chip Packaging Are Powering AI’s Future

Courtesy: Lam Research With all the attention being given to AI, it’s easy to overlook some of the core technologies enabling its capabilities. Sure, a...

The Forest Listener: Where edge AI meets the wild

Courtesy: Micron Let’s first discuss the power of enabling. Enabling a wide electronic ecosystem is essential for fostering innovation, scalability and resilience across industries. By...

20 Years of EEPROM: Why It Matters, Needed, and Its Future

ST has been the leading manufacturer of EEPROM for the 20th consecutive year. As we celebrate this milestone, we wanted to reflect on why the electrically...

The Grid as Strategy: Powering India’s 2047 Transformation

by Varun Bhatia, Vice President – Projects and Learning Solutions, Electronics Sector Skills Council of India.  As India approaches its centenary in 2047, the idea...

Engineering the Future of High-Voltage Battery Management: Rohit Bhan on BMIC Innovation

ELE Times conducts an exclusive interview with Rohit Bhan, Senior Staff Electrical Engineer at Renesas Electronics America, discussing how advanced sensing, 120 V power conversion,...

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