Electronics

    NEHU’s indigenous chip against Red Spider Mite for tea gardens

    The North-Eastern Hill University (NEHU) in Meghalaya, developed an innovative indigenous semiconductor chip aimed at repelling the Red Spider Mite, one of the most...

    India’s Semicon Programme: From Design to Packaging

    Union Minister of State for Electronics and Information Technology Shri Jitin Prasada, stated India’s achievements from the Semicon India Programme. The Indian Government launched...

    World’s First 5G NR NTN Certification: Anritsu and Samsung Lead RFCT Testing

    ANRITSU CORPORATION announced its New Radio RF Conformance Test System “ME7873NR” to have achieved PCS Type Certification Review Board (PTCRB) certification for the first...

    What Are Memory Chips—and Why They Could Drive TV Prices Higher From 2026

    As the rupee continues to depreciate, crossing the magical figure of 90, the electronics manufacturing industry in India is set to take a blow....

    Anritsu & HEAD Launch Acoustic Evaluation Solution for Next-Gen Automotive eCall Systems

    ANRITSU CORPORATION and HEAD acoustics have jointly launched of an advanced acoustic evaluation solution for next-generation automotive emergency call systems (“NG eCall”). The new solution...

    NAL-CSIR Advances Field testing of Indigenous Defence Tech

    The Council of Scientific and Industrial Research (CSIR)-National Aerospace Laboratories (NAL), in collaboration with Solar Defence & Aerospace Ltd. (SDAL), a private industry partner...

    Nissan Powering EV Component Plant with Repurposed Batteries

    Nissan Australia has launched the Nissan Node project, a circular economy initiative which will repurpose end-of-life Nissan Leaf batteries to power a section of...

    FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals

    CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...

    USB-IF Hardware Certification to Anritsu for USB4 2.0 Test Solution

    ANRITSU CORPORATION gets certified by the USB Implementers Forum (USB-IF) for its test solution for the latest USB4 Version 2.0 (USB4 v2) communication standard. The solution...

    As Energy-Efficient Chips Are Rising — HCLTech × Dolphin’s New Partnership Gives the Trend a...

    Amid the ongoing push, HCLTech & Dolphin Semiconductors have announced a strategic partnership aiming to develop energy-efficient chips for IoT and data centre applications....

    Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

    Courtesy: Lam Research As advanced logic chips decrease in size, voltage loss can increase An emerging solution is backside power delivery networks that use...

    Revamping a Solid-State Battery Cell

    Courtesy: Comsol Ever experience these common annoyances? You’re about to leave for the day and realize you forgot to charge your phone. Or, you’re on...

    Serrated Edges: For Less Noise and Improved Fan Performance

    Courtesy: Cadence Understanding Noise Reduction in Industrial Fans Industrial fans are widely utilized across various sectors, including manufacturing, automotive, and energy production, playing a vital role...

    Kyocera and Rohde & Schwarz’s multipurpose phased array antenna module (PAAM) at CES 2026

    Kyocera and Rohde & Schwarz will demonstrate the characterization of Kyocera’s novel phased array antenna module (PAAM) at CES 2026 in Las Vegas, NV....

    CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

    CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...

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