Electronics

Electronics

Gartner Forecasts Worldwide Semiconductor Revenue to Exceed $1.3 Trillion in 2026

ELE Times News -
Semiconductor Revenue to Grow 64% in 2026 DRAM Prices to Increase by 125% in 2026 and Storage Crisis to Extend into 2027 STAMFORD, Conn.,...
Electronics

STMicroelectronics’ new STM32 series redefines entry-level microcontroller performance and value for smart devices everywhere

ELE Times News -
STM32C5 with Cortex®-M33 and 40 nm for enhanced speed and Flash density Increased performance with cost efficiency Comprehensive ecosystem to enhance end-device capabilities...
News

STMicroelectronics and Leopard Imaging use NVIDIA Jetson-ready multi-sensor module for robotics vision 

ELE Times News -
STMicroelectronics and Leopard Imaging have introduced an all-in-one multimodal vision module for humanoid and other advanced robotics systems. Combining ST imaging, 3D scene-mapping, and...
Electronics

Graphene in Focus: How Nanotechnology is Transforming Electronics?

Kumar Harshit -
As miniaturisation and increasingly complex design architectures continue to define modern technology, nanotechnology is emerging as a frontier discipline shaping the trajectory of innovation—from...
News

FormFactor and Rohde & Schwarz Advance their Partnership for on-wafer RF Component Characterisation

ELE Times News -
FormFactor and Rohde & Schwarz have announced a strategic co-marketing partnership as part of FormFactor’s MeasureOne partner program, a solution-integration initiative designed to deliver...
News

Anritsu and SK Telecom Jointly Verify AI-Based Antenna Optimisation, POSTECH and Bluetest

ELE Times News -
ANRITSU CORPORATION has jointly verified AI-based antenna optimisation technologies with SK Telecom, South Korea’s leading mobile network operator, Pohang University of Science and Technology...
New Products

Cadence and NVIDIA Collaborate on Accelerated Engineering Solutions for Agentic AI Chip and System Design​

ELE Times News -
Cadence announced an expansion of its broad collaboration with NVIDIA to accelerate Cadence’s Design for AI and AI for Design strategy. The next generation of agentic AI...
New Products

R&S amplifiers enable high-field immunity testing expansion at IB Lenhardt Lab

ELE Times News -
IBL Lab GmbH, the DAkkS (Deutsche Akkreditierungsstelle GmbH) accredited EMC test laboratory of IB Lenhardt AG, has significantly expanded its high-field immunity testing capabilities...
New Products

Renesas Launches First Bidirectional 650V-Class GaN Switch For Multiple Uses

ELE Times News -
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, unveiled the industry’s first bidirectional switch using depletion-mode (d-mode) GaN technology, capable of blocking...
Semiconductors and Chips

Thermal Management in 3D-IC: Modelling Hotspots, Materials, & Cooling Strategies

ELE Times Research Desk -
Courtesy: Cadence As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted...
Analog

Intel Foundry Advances Chip Power Delivery with Next-Generation Capacitor Technology

ELE Times Research Desk -
Courtesy: Intel Highlights Intel and Intel Foundry researchers demonstrated three promising metal-insulator-metal (MIM) materials delivering intrinsic capacitance density up to 98 femtofarads per square micrometre...
New Products

Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

ELE Times News -
Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum transducer, the latest device in the company's PVC4000 series. Designed for cost-effective OEM integration, the...
Artificial Intelligence

Impact of AI on Computing and the Criticality of Testing

ELE Times Research Desk -
Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our daily lives, and improving efficiency and decision-making, but its need for computing power is growing...
India News

Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

ELE Times News -
Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio and FITS-8CH, the suite’s first product. FITS-8CH delivers digital-layer bit error ratio (BER) and forward...
Semiconductors and Chips

CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

ELE Times News -
CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialise NcodiN’s optical interposer technology on a 300...
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