HomeNewsIndia NewsKeysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio and FITS-8CH, the suite’s first product. FITS-8CH delivers digital-layer bit error ratio (BER) and forward error correction (FEC) performance validation for high-speed optical and copper interconnects used in network equipment and production network infrastructures.

    As interconnect speeds increase and designs grow more complex, manufacturers of chips, optical and copper interconnects, and network equipment face mounting pressure to ensure reliability before products reach mass production and throughout the manufacturing process. Traditional physical-layer test tools play a vital role in validating electrical lanes against industry specifications, establishing a strong compliance baseline. Building on this foundation, system-level validation helps extend insight into the performance of fully integrated interconnects and operational sub-assemblies, including error behaviour in realistic environments.

    Accurate assessment of real‑world system conditions is only possible when all interconnect electrical or optical lanes undergo high-speed error-performance validation. Without this testing, the risk of production delays or costly failures in the field increases. This includes validating error performance for high‑speed PAM4 electrical lanes operating at 53 Gb/s, 106 Gb/s, and 212 Gb/s, which underpin today’s 400GE, 800GE, and 1.6T Ethernet network architectures.

    FITS-8CH addresses this system-level error performance gap by providing multiple-lane error performance validation at the digital layer, supporting PAM4 error performance assessment across all relevant electrical lane speeds and extending beyond physical-layer measurements. This enables reliable validation throughout the design, development, and manufacturing of high-speed interconnects for high-volume deployment in large-scale networks. The chassis also integrates with Keysight’s physical layer test solutions, expanding the number of applications and topologies it supports.

    Built for reliability, scale, and manufacturing readiness, FITS‑8CH supports today’s network-testing demands, where even marginal error performance can impact large-scale deployments. Key benefits include:

    • Multiple-lane BER and FEC Validation: Enables simultaneous, bi‑directional real-time testing on all eight transmit and eight receive channels, supporting PAM4 signalling speeds from 53 Gb/s to 212.5 Gb/s. Validating system‑level error performance using BER and FEC enables testing of complete optical and copper interconnect assemblies rather than isolated measurements at critical stages, including R&D, product development, in‑process manufacturing, end‑of‑line testing, and system‑level qualification. Using this approach, manufacturers can confidently release verified pre‑production designs to mass production and benchmark reliability under real‑world operating conditions.
    • Flexible Channel Architecture: Two complementary channel groups — high‑drive outputs and chip‑to‑module (C2M) interfaces — support a broader range of electrical fixtures and interconnect topologies. This architecture gives teams greater flexibility to support more configurations of electrical fixtures, Ethernet interconnects, active cables, and silicon topologies without redesigning test setups or compromising signal fidelity.
    • High‑Quality Signal Generation: IEEE P802.3dj‑compliant signal generation and excellent signal integrity performance, even under difficult conditions, provide clean, well‑controlled transmit signals required for accurate BER and FEC measurements at all supported channel speeds. By delivering signals that meet defined requirements, teams can evaluate error performance based on the true behaviour of the device or interconnect under test, rather than limitations introduced by the test environment. This is especially important in high‑speed, multiple-lane designs, where small signal variations can lead to borderline or misleading results.
    • Automated Lane Tuning: Optimises PAM4 signal output performance with lane‑by‑lane tuning that automatically adjusts transmit tap settings and opens the electrical eye of the PAM4 signal for each lane. This improves measurement consistency and repeatability, reducing the risk of passing assemblies with marginal or borderline error performance.
    • Early Detection of Manufacturing and Configuration Issues: Identifies problems such as mechanical misalignment, thermal failures, and non-optimised or incorrect digital signal processor (DSP) tap settings during in‑process or end‑of‑line testing—reducing the costly impact and likelihood of defective products reaching customers.

    Kenji Liao, High‑Speed Interconnect PM Director, UDE Corporation, said: “With FITS‑8CH, Keysight provides the digital‑layer error performance analysis we need to verify 1.6T AEC BER‑per‑lane requirements under realistic operating conditions. The ability to characterise lane‑level error behaviour across complete interconnect assemblies helps us identify margin issues earlier and maintain consistency as we transition designs into volume production. Integrating this solution into our development and manufacturing workflow strengthens our confidence that UDE’s high‑speed interconnects will meet the stringent performance targets our customers expect. The partnership between UDE and Keysight allows us to use this new solution to support error performance validation across development and manufacturing.”

    Ram Periakaruppan, Vice President and General Manager, Network Test & Security Solutions, Keysight, said: “As validation requirements move up the stack from the physical layer, our customers increasingly need solutions that scale across development, manufacturing, and deployment. FITS‑8CH represents Keysight’s expansion into digital‑layer interconnect validation, combining years of deep measurement expertise with the global reach, field support, and portfolio continuity customers rely on for production environments, including AI data centres.

    This is the first offering in our FITS portfolio, a new series of solutions designed to support error performance validation across the entire product lifecycle.”

    ELE Times News
    ELE Times Newshttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology, and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified, and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads, and market your products favorably.

    Related News

    Must Read

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...

    How good are ultra-low bitrate speech codecs?

    Courtesy: Rhode and Schwarz Quality Evaluation of Speech Coding Technologies A...

    NXP CoreRide Puts Automakers on Fast Path to 48 V Scalable Zonal Architectures

    NXP Semiconductors introduced its NXP CoreRide Z248 zonal reference...

    Microchip Helps Manufacturers Meet Cybersecurity Regulations, Expands Security Services in the Trust Platform

    As cybersecurity regulations tighten worldwide, product manufacturers must embed...

    Everspin Launches New Generation of Unified Memory for Embedded Systems

    Everspin Technologies, a leading developer and manufacturer of magnetoresistive...

    TI’s microcontroller portfolio and software ecosystem expanded to enable edge AI in every device

    Texas Instruments (TI) introduced two new microcontroller (MCU) families...

    R&S to showcase future-proof EMC testing solutions at EMV 2026

    Rohde & Schwarz will participate in EMV 2026, Europe’s...

    Infineon extends leadership position in global microcontroller market

    Infineon Technologies further extends its number one position in...

    Traction Inverter: Keys to understanding the inverter, the traction, and why X-in-1 solutions are increasingly popular

    Courtesy: STMicroelectronics Traction inverters are at the heart of electric...