Electronics

Automotive

NXP CoreRide Puts Automakers on Fast Path to 48 V Scalable Zonal Architectures

ELE Times News -
NXP Semiconductors introduced its NXP CoreRide Z248 zonal reference system - the semiconductor industry’s first pre-validated, design-ready zonal foundation that combines advanced 48 V...
Embedded

Everspin Launches New Generation of Unified Memory for Embedded Systems

ELE Times News -
Everspin Technologies, a leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, today announced the UNISYST MRAM family, a new generation...
Electronics

Photonics-electronics Convergence Technology Becomes Essential to Next-generation DCs Precise Measurements Required for DCI Evaluation

ELE Times Research Desk -
Courtesy: Anritsu Corporation Due to the capacity constraints imposed by metropolitan areas, there is a growing trend to shift towards decentralized regional data centers. Along...
Automotive

Driving the Future of Vehicle E/E Architecture: Arrow Electronics to Support Next-Generation Mobility

ELE Times Research Desk -
By Murdoch Fitzgerald, chief growth officer of global services for Arrow’s global components business, and Dr. Raphael Salmi, president of Arrow Electronics’ South Asia,...
Automotive

Designing LIDAR on a Chip: A Multiphysics Simulation Workflow for Integrated Photonics

ELE Times Research Desk -
Courtesy: Keysight Introduction LIDAR (Light Detection and Ranging) has become a cornerstone technology for autonomous vehicles, enabling high-resolution spatial mapping and object detection. As the industry...
Automotive

From 10 to 1000 TOPS: Why Automotive Chips Need a New Architecture

Kumar Harshit -
Speaking at the Auto EV Tech Vision Summit 2025, Namrta Sharma, Technical Director at Aritrak Technologies, highlighted how chiplet architectures are emerging as a...
Aerospace and Defence

New LX4580 – Highly Integrated 24‑Channel Mixed‑Signal IC for Aviation & Defence Actuation Systems

ELE Times News -
Microchip Technology announces the LX4580, a 24‑channel mixed‑signal IC designed to streamline high‑reliability actuation control systems for aviation and defence applications. The LX4580 is highly...
Memory

Everspin Advances High-Reliability xSPI MRAM Portfolio With Complete Production Qualification for 64Mb MRAM

ELE Times News -
Everspin Technologies, the world’s leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced continued progress across its high-reliability (HR)...
Memory

Differentiating Between LPDDR6, LPDDR5, and LPDDR5X

ELE Times Research Desk -
Courtesy: Synopsys Advances in memory standards are driving faster and more power-efficient mobile and connected devices, from smartphones and tablets to ultra-thin laptops and wearables. One...
Test and Measurement

R&S Propels 6G Readiness With FR1–FR3 Carrier Demonstration

ELE Times News -
Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1...
Battery and Energy Storage

Two Batteries, Two Futures: Why LFP and NMC Are Splitting the EV & Energy Landscape

Kumar Harshit -
Batteries have quietly become the limiting factor of modern technology. They define how far an electric vehicle can go, how safely energy can be...
Semiconductors and Chips

Top Seven Tech Trends in the semiconductor sector for 2026

ELE Times Research Desk -
By: STMicroelectronics In 2026, a new class of intelligent machines will emerge. Several of the trends we’ve identified are natural extensions of those we highlighted...
Test and Measurement

R&S and Broadcom showcase first Wi-Fi 8 RF signalling tests, paving way for next-gen connectivity

ELE Times News -
Rohde & Schwarz, in collaboration with Broadcom, is set to display its CMX500 multi-technology multi-channel signalling tester at MWC Barcelona 2026 with newly added...
Artificial Intelligence

The Rise of the AgentEngineer: How AI is Orchestrating the Future of Chip Design

ELE Times Research Desk -
While traditional Electronic Design Automation tools have been faithfully executing commands for decades, today's agentic AI systems are rewriting the rulebook by thinking, iterating,...
Artificial Intelligence

Manufacturing Breakthroughs in Chip Packaging Are Powering AI’s Future

ELE Times Research Desk -
Courtesy: Lam Research With all the attention being given to AI, it’s easy to overlook some of the core technologies enabling its capabilities. Sure, a...
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