Electronics

    Nissan Powering EV Component Plant with Repurposed Batteries

    Nissan Australia has launched the Nissan Node project, a circular economy initiative which will repurpose end-of-life Nissan Leaf batteries to power a section of...

    FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals

    CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...

    USB-IF Hardware Certification to Anritsu for USB4 2.0 Test Solution

    ANRITSU CORPORATION gets certified by the USB Implementers Forum (USB-IF) for its test solution for the latest USB4 Version 2.0 (USB4 v2) communication standard. The solution...

    As Energy-Efficient Chips Are Rising — HCLTech × Dolphin’s New Partnership Gives the Trend a...

    Amid the ongoing push, HCLTech & Dolphin Semiconductors have announced a strategic partnership aiming to develop energy-efficient chips for IoT and data centre applications....

    Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

    Courtesy: Lam Research As advanced logic chips decrease in size, voltage loss can increase An emerging solution is backside power delivery networks that use...

    Revamping a Solid-State Battery Cell

    Courtesy: Comsol Ever experience these common annoyances? You’re about to leave for the day and realize you forgot to charge your phone. Or, you’re on...

    Serrated Edges: For Less Noise and Improved Fan Performance

    Courtesy: Cadence Understanding Noise Reduction in Industrial Fans Industrial fans are widely utilized across various sectors, including manufacturing, automotive, and energy production, playing a vital role...

    Kyocera and Rohde & Schwarz’s multipurpose phased array antenna module (PAAM) at CES 2026

    Kyocera and Rohde & Schwarz will demonstrate the characterization of Kyocera’s novel phased array antenna module (PAAM) at CES 2026 in Las Vegas, NV....

    CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

    CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...

    Beyond the Bill: How AI-Enabled Smart Meters Are Driving Lead Time Optimization and Supply Chain...

    Introduction Smart meters have significantly evolved since their initial implementation for consumer billing. In the contemporary networked industrial landscape, where semiconductor fabrication facilities, data centers,...

    Inside the Digital Twin: How AI is Building Virtual Fabs to Prevent Trillion-Dollar Mistakes

    Introduction Semiconductor manufacturing often feels like modern alchemy: billions of tiny transistors squeezed onto a chip smaller than a fingernail, stitched through thousands of precise...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship cutting edge Power Semiconductor Devices and technology to the Indian market. MEI Participation in PCIM...

    India needs up to 15,000 crore more investment for PCB manufacturing: JS Gujral, MD, Syrma...

    In the budget for 2021, the Indian government sanctioned Rs. 76,000 crores for the India Semiconductor Mission (ISM). Today, after nearly five years, there...

    The Unsung Hero: How Power Electronics is Fueling the EV Charging Revolution

    The electrifying shift towards Electric Vehicles (EVs) often dominates headlines—all talk of battery range, colossal Gigafactories, and the race to deploy charging stations. Yet,...

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