STMicroelectronics Reveals STPay-Mobile Platform, Driving Flexible and Scalable Virtual Ticketing and Payments
STMicroelectronics (NYSE: STM), has launched STPay-Mobile, a platform that simplifies virtualization of security-critical public transit ticketing and payment cards on smartphones and wearables.
STPay-Mobile helps...
Analog Devices, University of Limerick and Stripe Collaborate for the Transformation of Engineering
Analog Devices has collaborated with the University of Limerick (UL) and other prominent companies, including economic infrastructure technology leader Stripe, to launch a world-leading computer...
AEC-Q100 Qualified and Defense-grade PolarFire FPGAs
Automotive, Defense, aerospace and industrial designers who need automotive- and defense-grade programmable logic solutions can now order PolarFire Field Programmable Gate Arrays (FPGAs) in...
New NGU Source Measure Units by Rohde & Schwarz
element14 offers the new NGU series of source measure units (SMU) from Rohde & Schwarz, one of the world's leading manufacturers of electronic test and...
New System for 3D Selective Solder Joint Inspection
With a new GOEPEL electronic integration solution, optical inspection of selective solder joints in 3D is now also possible. The AOI module "Selective Line...
First IEEE 802.3bt Power over Ethernet to USB Type-C Power and Data Adapter
There are many consumer, enterprise, and industrial devices today that have a USB Type-C port as the only input power option. While USB-C technology can...
Teaching a Machine, How to Identify Imperfections in 2-D Materials
Machine-learning could identify different areas of interest on 2-D materials. The simple, automated optical identification of fundamentally different physical areas on these materials (eg,...
Cooperative Eco-Driving Automation Improves Energy Efficiency and Safety
Imagine you're driving up a hill toward a traffic light. The light is still green so you're tempted to accelerate to make it through...
Scientists Investigate 3-D-Printed High-Entropy Alloys
Scientists from the Skoltech Center for Design, Manufacturing and Materials (CDMM) and the Institute for Metals Superplasticity Problems (IMSP RAS) have studied the fatigue...
Examining the Environmental Impact of Computation and the Future of Green Computing
When you think about your carbon footprint, what comes to mind? Driving and flying, probably. Perhaps home energy consumption or those daily Amazon deliveries....
