ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to announce that the LineMaster Fusion 3D takes inline SPI to a new level with its unmatched price the performance value proposition. The Fusion 3D provides all of the required features for high-speed inline 3D solder paste inspection at an amazingly affordable price.
The LineMaster Fusion 3D provides sophisticated 3D solder paste measurement coupled with an intuitive user interface and Windows 10 OS. With only a few minutes of training, an operator can perform accurate and reliable 3D measurements of solder paste deposits as well as many other important SMT measurement applications. LineMaster’s completely automatic solder paste measurement process eliminates manual board handling as found with offline SPI systems and provides operators with immediate feedback to reduce printer related defects.
With industry-leading 4um X-Y pixel resolution and .17um Z height resolution sensor technology, the Fusion 3D provides exceptional value for the electronics manufacturer concerned with improving production yields hindered by the poor overall quality of their print process. The SPI system features five-minute Gerber/CAD import programming with fully integrated SPC analytics, real-time data review and qualitative analysis of solder paste deposition utilizing realistic 3D rendering for accurate print quality detection.
