StenTech Inc., the leading multinational SMT Printing Solutions company, received the 2023 CIRCUITS ASSEMBLY NPI Award in the category, Screen/Stencil Printing Peripherals/Consumables for its new Advanced Nano Coating. The award was announced during a ceremony that took place in San Diego.
The company’s director of sales, Greg Starrett said, “We are so honored to have won this prestigious award, We knew we had something special when we were developing Advanced Nano and we are thrilled that our customers and industry leaders agree.”
Advanced Nano is a highly unique coating that is applied to the bottom side of the stencil and inside the apertures, the squeegee side remains uncoated. This coating provides the stencil with anti-adhesion properties. Advanced Nano utilizes a specialized 1-3 um hardened nano-coating. This permanent hydrophobic and oleophobic coating repels solder flux, allowing increased transfer of paste. Advanced Nano increases transfer efficiency up to 25 percent, and enables significantly less bridging due to its paste efficiency benefits. Due to the anti-adhesion or “non-stick” characteristics, underside cleaning is reduced, giving customers a better yield and less expense on rework and touch-up. Stencils coated with Advanced Nano are ready for use just 30 minutes after coating.
Introduced in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
