HomeNewsIndia NewsCompanies collaborate to demonstrate industry’s first Pole Mounted Edge AI and ML...

Companies collaborate to demonstrate industry’s first Pole Mounted Edge AI and ML solution

ADLINK Technology and Charles Industries, Ltd. (Charles) have joined together to demonstrate the industry’s first complete micro-edge low latency Artificial Intelligence/Machine Learning/Deep Learning (AI/ML/DL) solution that can be co-located on LTE small cell poles or with emerging 5G radios. The solution is being demonstrated at the NVIDIA GPU Technology Conference (GTC), March 19-21, at the San Jose McEnery Convention Center in Booth #317.

The new solution is a compact low profile pole or wall mountable unit based on an integration of ADLINK’s latest AI Edge Server MECS-7210 and Charles’ SC102 Micro Edge Enclosure. Combining the rugged designs from the two industry-leading companies, this advanced solution is ideally suited for outdoor telecom use cases and well positioned to be deployed globally enabling carriers and communities to provide a wide range of new and advanced services, including autonomous vehicles/pods, virtual and augmented reality applications, vision analytics with additional AI/ML/DL applications.

The solution further demonstrates ADLINK and Charles’ commitment to facilitating the transformation of communications network architectures in the era of 5G. Powered by advanced, dual-socket Intel Xeon Scalable processors, the MECS-7210 is a high performance, cost effective commercial-off-the-shelf (COTS) platform in a small footprint 2U chassis with 420mm of system depth. Designed for all I/O front access, dust prevention, wide operation temperature, and dual full-height full-length (FHFL) PCIe expansion slots reserved for access to acceleration hardware (FGPA/GPU), ADLINK’s MECS-7210 is among the first platforms to fully comply with Open Telecom IT Infrastructure (OTII) defined by Open Data Center Committee (ODCC) to meet 5G requirements of ultra-low latency, high bandwidth, real-time access to radio network.

Charles’ SC102 Micro-Edge Enclosure has been custom-designed for the MECS-7210, using advanced thermal modeling to ensure reliable, high-end AI and compute equipment performance in harsh outdoor operating environments. To be able to handle the extreme temperature ranges and rugged attributes of telecom edge technologies, the SC102 Micro-Edge Enclosures complies with the stringent Bellcore GR-487 specifications for an outdoor ambient environment of -40ºC to +55ºC.  The enclosed solution integrates system cooling and power by incorporating a 1,880W heat exchanger and 250W heater, and providing power feed options for either AC or DC depending on site availability. In addition, the enclosure is sealed against environmental elements such as rain, wind, ice, and sun and equipped with alarms for temperature and door intrusion.

For more information, visit: www.adlinktech.com

ELE Times Research Desk
ELE Times Research Deskhttps://www.eletimes.ai
ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

Related News

Must Read

OfficeNet Launches Smart Factory Platform to Streamline Workforce Management

OfficeNet, an HR technology company serving more than 10...

Renesas Launches Ultra-Low-Power RL78/G21 MCU for Smart Appliance Control

Renesas Electronics Corporation has introduced the RL78/G21, a new...

DigiKey Adds 27,000 New Stocking Products and 93 Suppliers in Q3 2026

DigiKey, a global distributor of electronic components and automation...

Microchip Achieves Key Milestones in PIC64-HPSC Spaceflight Computing Development

As spacecraft and satellites become more autonomous and rely...

Infineon to Build Europe’s First High-Volume 300mm GaN Power Semiconductor Manufacturing Facility

Infineon Technologies AG is setting up Europe’s first high-volume...

Powering India’s Growth: Key Companies in the Electrical Infrastructure Value Chain

India’s growing real estate sector and investments in power...