New Tailor-Made Digital Solutions for Small And Medium Enterprises
Global Channel Resources (GCR), a brand renowned for its SaaS connected IoT solutions and networking infrastructure now offers Tailor-Made Digital solutions for the MSME...
Cooperation on Digital communications & economy discussed between India and European Commission
The Minister of State for Communications (Independent Charge) Government of India, Manoj Sinha and the European Commissioner for Digital Single Market and Vice President...
NORD DRIVESYSTEMS to exhibit anti-corrosion treatment at BrauBeviale 2018
At BrauBeviale, NORD demonstrates the difference in the efficiencies of the IE3 asynchronous motor and the IE4 synchronous smooth motor in a direct comparison...
CEA-Leti Middleware will be core of Fog Platform for decentralized Cloud-to-Edge AI
Leti, a research institute at CEA-Tech, announced that its sensiNact Internet of Things (IoT) middleware will be the core of a platform under development...
Arm DesignStart program expands to accelerate Linux-based embedded design
While the breadth of IoT provides endless possibilities for advanced software development, it also holds challenges for designers. In a rapidly changing and competitive...
New High-Speed CMOS PSRAMs Offer densities From 8Mb to 128Mb in 48-Ball and 49-Ball FPBGA Packages
Alliance Memory introduced a new family of high-speed CMOS pseudo SRAMs (PSRAMs) with densities from 8Mb to 128Mb in 6.0 mm x 7.0 mm x...
RXv3 CPU Core with Industry-Leading Performance: Powering Up New 32-Bit RX MCU Families
Renesas Electronics Corporation announced the development of its third-generation 32-bit RX CPU core, the RXv3. The RXv3 CPU core will be employed in Renesas’...
Government plans to roll out 1 million Wi-Fi hotspots by December next year
The telecom industry will roll out one-million Wi-Fi hotspots in the country by December next year, which is another step towards the digital empowerment...
Launch of the Alternative to Dow Corning’s CN-8760 Encapsulant
Electrolube, global electro-chemicals manufacturer has recently formulated and is preparing to launch a brand new thermally conductive encapsulation resin at Electronica (Munich, November 13-16...
New Widest Voltage Range and Smallest Footprint with Himalaya uSLIC family additions
Now engineers designing into applications in factory automation, medical, communications and consumer markets can tap into four new micro-system-level IC (“uSLIC”) modules from Maxim...
