Embedded board design kits for COM Express Type 6 modules based on the 6th generation of Intel Core processors, these are the previously codenamed Skylake U and H processors, have been introduced by Avnet Embedded.
Embedded board design kits for COM Express Type 6 modules based on the 6th generation of Intel Core processors, these are the previously codenamed Skylake U and H processors, have been introduced by Avnet Embedded.
The Skylake H CPUs range from Celeron dual-core, Core i3, i5 and i7 all the way up to Xeon quad-core 14nm processors clocking up to 3.7GHz. These are the highest performance COM Express modules.
The lower performance Skylake U processors are limited to a thermal power dissipation of 15W.
A configurable thermal design power means they can be limited to 7.5W for system designs with passive cooling.
These CPUs include Celeron, Core i3, i5 and i7 processors.
The two starter kits feature the new COM Express Type 6 carrier board MSC C6-MB-EV in the mini-ITX form factor, two SO-DIMM DDR4 memory modules, heat sink and suitable power supply.
A universal mini-ITX baseboard provides the COM Express socket for Type 6 modules with interfaces: PCIe x4, SATA, USB 3.0 and 2.0, GbE LAN, LPC, UART, GPIO and HD Audio.
Various graphics outputs are available: DisplayPort, embedded DisplayPort (eDP) and LVDS, along with an adjustable backlight power and dimming output for LCD panels. The board comes with a PCI Express mini card socket for functional extension and an SD card slot.
Manufactured by MSC Technologies in Germany, the COM Express starter kits MSC C6-SK-SLH-EV-KIT001 for Skylake H and MSC C6-SK-SLU-EV-KIT001 for Skylake U based Type 6 modules are available immediately.
