HomeNewsIndia NewsMouser stocks fast, compact molex nano-pitch I/O interconnect system

    Mouser stocks fast, compact molex nano-pitch I/O interconnect system

    Mouser Electronics, Inc. is now stocking the Nano-Pitch I/O interconnect system from Molex, LLC. The system’s multi-protocol pinout concept enables compatibility with all known SAS, SATA and PCIe protocols and provides enhanced signal integrity in an extremely compact form factor. The connector is ideal for SAS and PCIe applications, including storage-to-controller, server-to-server, server-to-switch, switch-to-switch, and mobile and enterprise.

    The Molex Nano-Pitch I/O interconnect system, available from Mouser Electronics, benefits new high-performance applications by delivering robust, small-form-factor, high-speed and multi-protocol interconnects ideal for both internal and external solutions. The Nano-Pitch I/O system features a continuous ground-signal-signal-ground pinout concept, which optimizes it for high-speed applications and maximizes the number of high-speed lanes within the lengths provided. The system provides up to 12 gigabits per second (Gbps) per channel in SAS 3.0, and up to 16 gigatransfers per second (GT/s) per channel in PCI Express. The system’s low-profile connector solution supports SAS-3/SAS-4 and PCIe Gen 3/Gen 4 interfaces, while the 42-circuit, 0.50mm-pitch, metal shell SMT connectors are available in both right-angle and vertical versions to fit a variety of placement options.

    The Nano-Pitch I/O system offers staggered, reliable and constant dual-row contact configuration, enabling engineers to add components without shutting down the system (known as hot pluggability). The connectors also provide optimal routing for high-speed trace connections while reducing the need for PCB real estate. The Nano-Pitch I/O interconnect system provides inventory and manufacturing assembly efficiencies in data center and enterprise storage systems, storage racks, storage controllers, and host bus adapter (HBA) servers, as well as telecom hubs, servers, switches, and routers.

    For more information about the Nano-Pitch I/O interconnect system, visit http://www.mouser.com/new/molex/molex-nano-pitch-io-system/.

     

     

     

     

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Arrow Electronics and Infineon introduce 240W USB-C PD 3.2 reference design for battery-powered motor control applications

    Arrow Electronics and Infineon Technologies AG have announced REF_ARIF240GaN, a...

    Robotics Engineering: The Architectural Evolution Behind IT–OT Convergence

    Factories today operate as dense mechanical ecosystems, whether in...

    How AI Is Transforming Network Protocol Testing in Software-Defined Networks?

    As enterprises accelerate toward cloud-native infrastructure, edge computing, and...

    What is Fashion Tech? Providing New Product Value and Customer Experiences with Technology

    Courtesy: Murata Electronics What is fashion tech? - diverse technologies...

    Emergency Screaming Detection: How AI Recognizes Human Screams and Saves Lives

    Courtesy: Renesas Detecting human screams for help is important in...

    India’s Electronics Push: Ambition Is Clear. Execution Will Decide the Outcome

    India’s electronics story has entered a decisive phase. The...

    India on the Road to Semicon Self-Reliance with Three More Plants

    India to welcome three more semiconductor plants after PM...

    Upcoming years to Bring Boom for Semiconductors and Electronics

    Union Minister for Electronics and Information Technology Ashwini Vaishnaw...

    R&S Propels 6G Readiness With FR1–FR3 Carrier Demonstration

    Rohde & Schwarz and Qualcomm Technologies, Inc. have reached...

    ROHM and Suchi Semicon Establish a Strategic Semicon Manufacturing Partnership in India

    ROHM and Suchi Semicon have announced the establishment of...