HomeNewsIndium Corporation Mourns the Loss of Board Chairman William N. Macartney III

    Indium Corporation Mourns the Loss of Board Chairman William N. Macartney III

    It is with great sadness that Indium Corporation announces the passing of Chairman William (Bill) N. Macartney III on September 14, 2021.

    Macartney leaves behind a company he served loyally for more than 50 years. Macartney joined in 1967 and was named President in 1970. He was named Chairman in 2017.

    Over these many decades, the Indium Corporation has enjoyed consistent, steady growth and significant market expansion. Under Macartney, Indium Corporation grew from approximately 20 employees to nearly 1,200 today and from one facility in Utica, NY, USA to 14 modern and ever-expanding facilities worldwide.

    “The hallmarks of Bill’s leadership were his devotion to the people who worked for him, his caring for community, and his commitment to customers who have relied on Indium Corporation to provide outstanding products that have truly impacted the world,” stated Greg Evans, CEO.

    “Bill believed that materials science changes the world and he made that a fundamental element of the culture of Indium Corporation,” said Ross Berntson, President and COO. “He provided the platform for our team to continuously look for the next technological advancement.”

    Appointment of a new chairman will be completed at the discretion of the board of directors. Evans remains as CEO and Ross Berntson as President and COO.

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...