STMicroelectronics and Feig Electronic Collaborate on Contactless Product Personalization for Fast, Flexible, Cost-Efficient Logistics
Convenient NFC-based solution extends readable area to 1m x 1m x 1m for fast personalization of palletized items
Leveraging ST25DV dynamic tags, eliminates...
Qualcomm Working on New Chips for Mid-range Devices
Chipmaker Qualcomm is reportedly working on a number of new platforms for mid-range smartphones. These new processors will be launching under the Qualcomm Snapdragon...
Not just JioPhone Next, Chip Shortage May Delay Launch of Many New Phones
JioPhone Next is not the first model whose launch is being affected due to a severe shortage of components and shipping delays. Several top brands...
The Longest 3D-printed Concrete Bicycle Bridge in the World
With a length of 29 meters, the Dutch city of Nijmegen now has the longest concrete 3D-bicycle bridge in the world. The project is...
Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
Routers, switches and line cards need higher bandwidth, port density and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data center traffic...
Machine learning improves biological image analysis
Scientists use super-resolution microscopy to study previously undiscovered cellular worlds, revealing nanometer-scale details inside cells. This method revolutionized light microscopy and earned its inventors...
Power Integrations’ New SCALE-iFlex LT Plug-and-Play Gate Driver Improves EconoDUAL IGBT Module Performance by 20%
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced its new plug-and-play SCALE-iFlex LT dual gate-drivers. The new...
EPS Global Joins Nuvoton’s MCU Security Partner Ecosystem
EPS Global, one of the world’s largest Programming and Secure Provisioning service providers, announced that it has joined Nuvoton’s Security Partner Ecosystem, making its...
Rohde & Schwarz Introduces R&S VSESIM-VSS that Combines EDA Simulation with Hardware Testing
T&M expert Rohde & Schwarz and Cadence have collaborated on a solution aimed at simplifying the engineering process from RF design to implementation and...
GaN-on-diamond Semiconductor Material that is Stable to 1,000 C
The need for more powerful electronic devices in today's society is curtailed by our ability to produce highly conductive semiconductors that can withstand the...
