TopLine will exhibit its innovative CCGA technology and Daisy Chain component solutions at INTERNEPCON JAPAN from 15 – 17 January 2020 at the Tokyo Big Sight venue. INTERNEPCON JAPAN is one of seven (7) shows comprising NEPCON JAPAN 2020, the 34th Electronics R&D, Manufacturing and Packaging Technology Expo.
TopLine’s CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions.
In addition to CCGA solutions, TopLine also manufactures Daisy Chain test components, Zero Ohm PCB jumpers and engineering evaluation kits for experimentation. TopLine also makes vibration dampers to extend the life of PCB assemblies. These and other TopLine innovations will be on exhibit in the show booth.
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