Semiconductors and Chips

Samtec Flyover QSFP Cable Systems Now Available at Mouser

Mouser Electronics, the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now shipping Flyover QSFP...

Testing Automotive MCU – An Overview

Introduction There is a growing share of electronics in a car, ranging from infotainment, body and engine controls to advanced driver-assistance modules. Today, premier cars...

Congatec Introduces New Computer-on-Modules with 13th Gen Intel Core Processors

Congatec – a leading vendor of embedded and edge computing technology – has announced the availability of COM-HPC and COM Express Computer-on-Modules based on...

Onsemi’s EliteSiC Silicon Carbide Family Solutions Deliver Industry-Leading Efficiency

Onsemi, has introduced “EliteSiC” as the name of its silicon carbide (SiC) family. The company will showcase three new members of the family –...

Cadence LPDDR5X IP Solution Targets Next-gen AI, Automotive and Mobile Applications

Cadence's LPDDR5X memory IP solution consists of a silicon-proven PHY and controller designed to connect to LPDDR5X DRAM devices that follow the JEDEC JESD209-5B...

New Artificial Nanostructures for Infrared Absorption Technologies

A new method to confine and absorb infrared (IR) light with GaN nanostructures can help develop highly efficient infrared absorbers, emitters, and modulators that are...

Apple main Supplier TSMC will Start Mass Production of 3nm Chips soon

Apple's main chip supplier Taiwan Semiconductor Manufacturing Company (TSMC) will reportedly start mass production of its 3-nanometer chip process for the next generations of Mac, iPhone and...

Samsung Electronics Develops Industry’s First 12nm-Class DDR5 DRAM

Samsung Electronics has announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry’s first 12-nanometer (nm)-class process technology, as well as...

India To Launch ‘Future Labs’ To Channel R&D Capital For Semiconductors, Deep-Tech Development: Rajeev Chandrasekhar

The Minister of State for Electronics & Information Technology Rajeev Chandrasekhar has said that the government will soon launch labs to channel R&D capital...

The Impact of 3D Heterogeneous Integration on Semiconductor Device Reliability

Challenges 3D IC heterogeneous assemblies need to overcome to ensure reliability Reliability has been challenging in the integrated circuit (IC) space but was manageable with...

MathWorks Simulink Now Support Infineon’s Automotive MCUs

MathWorks and Infineon Technologies announced a hardware support package for the MathWorks Simulink products for Infineon’s latest AURIX TC4x family of automotive microcontrollers. Automotive...

Analysis of Magnetic and Thermal Semiconductor Power Modules

Over the past few years, semiconductor technology has come a long way, especially in the fields of power electronics with applications in research and...

Tata to Enter Chipmaking in India: Chairman Natarajan Chandrasekaran

India's Tata Group will begin producing semiconductors in the country within a few years, a move that the chairman of the group's main company...

AAEON’s UP Xtreme i12 Offers up to 20% Greater CPU Performance

Improving upon the 11th Generation Intel Core Processor SoC of its predecessor, the UP Xtreme i11, AAEON’s next-generation UP Xtreme i12 utilizes the 12-core,...

Ashwini Vaishnaw sets up 6 task forces to develop component ecosystem

Telecom Minister Ashwini Vaishnaw informed that a total of six task forces have been set up to develop the component ecosystem. He made this...

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