Semiconductors and Chips

STMicroelectronics Launches new MDmesh MOSFETs, Raising Power Density and Efficiency

STMicroelectronics’ STPOWER MDmesh M9 and DM9 N-channel super-junction multi-drain silicon power MOSFETs are ideal for switched-mode power supplies (SMPS) in applications from data-center servers and 5G infrastructure to...

Semiconductor Driving the Low-energy Electronics Advancements

A research partnership between Penn State and the Massachusetts Institute of Technology (MIT) could enable an improved method to make a new type of...

Embedding Metal Microstructures in Glass

Safe from harsh environmental conditions, electrically and thermally conductive, and with great lithographic resolution: Embedding thin metal microstructures in glass promises exceptional properties for...

Silicon Carbide cooperation between SEMIKRON and ROHM Semiconductor

SEMIKRON, headquartered in Nuremberg, and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regard to the implementation of...

Automotive Open System Architecture Ready Devices and Ecosystem

Automotive Open System Architecture (AUTOSAR) addresses the challenge of increasing software complexity by providing an open and exchangeable solution to standardize the software architecture...

Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology Ecosystem

Lam Research Corp., Entegris, Inc., and Gelest, Inc, a Mitsubishi Chemical Group company, today announced a strategic collaboration that will provide semiconductor manufacturers worldwide...

STMicroelectronics and GlobalFoundries to Advance FD-SOI Ecosystem with new 300mm Manufacturing facility in France

STMicroelectronics, a global leader in feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor...

STMicroelectronics extends Microsoft Azure RTOS Development across STM32 Microcontroller family

STMicroelectronics has extended support for Microsoft Azure RTOS in the STM32Cube development environment, covering additional high-performance, mainstream, ultra-low-power and wireless microcontrollers (MCUs) from the...

Shrinking Microchips with 1D Helium Model System

Physicists at Indiana University and the University of Tennessee have cracked the code for making microchips smaller, and the key is helium. Microchips are everywhere,...

Next-gen Analog Chipsets for AI Applications

Researchers at the Indian Institute of Science (IISc) have developed a design framework to build next-generation analog computing chipsets that could be faster and...

Improving Carrier Mobility in 2D Semiconductors

Two-dimensional (2D) semiconductors are semiconducting materials with thicknesses on the atomic scale, which have exceptional electronic properties. In the future, these materials could have...

Wirepas and Nordic Semiconductor Demonstrate the World’s First Non-Cellular 5G Connection 

Massive IoT is becoming a reality with the non-cellular 5G Mesh. A test network acts as the product proof of concept demonstration. It visually...

Scrutinizing Temperature Effect on SOAs

The effect of temperature on the performance of the semiconductor optical amplifiers (SOAs) is an important research point. Amer Kotb and his colleagues from...

Leading Semiconductor Players to Advance Next Generation FD-SOI Roadmap for Automotive, IoT and Mobile Applications

CEA, Soitec, GlobalFoundries and STMicroelectronics have announced a new collaboration in which they intend to jointly define the industry’s next-generation roadmap for FD-SOI (fully...

System on Module based on Intel Stratix 10 SOC FPGA

iWave Systems unveils the first look of Intel Stratix 10 powered System on Module at embedded world 2022. The System on Module is compatible...

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