Faster than ever Capacitive touch evaluation and rapid prototyping
element14 announce the launch of Texas Instruments’ MSP CapTIvate microcontroller (MCU) development kit, a comprehensive, easy-to-use platform providing real-time sensor tuning, all without writing a single line of code. The modular design, easy to access data and application orientated approach of the MSP430FR2633-based MCU board, contained within the kit, makes it ideal for application in, for example, thermostats, white goods and personal electronics.
The kit contains a CAPTIVATE-FR2633 target MCU module, CAPTIVATE-PGMR eZ-FET with EnergyTrace technology and HID communication bridge, CAPTIVATE-ISO UART, I2C, and SBW isolation board, CAPTIVATE-BSWP self-capacitance demo (Out-of-Box Experience), CAPTIVATE-PHONE mutual capacitance demo with haptics and guard channel and CAPTIVATE-PROXIMITY proximity detection and gesturing demo.
The MSP430FR2633-based MCU board, a programmer/debugger board with EnergyTrace technology measures energy consumption with the TI’s Code Composer Studio™ integrated development environment (IDE), and sensor boards to evaluate self-capacitance, mutual capacitance, gesture and proximity sensing. Users can evaluate the MSP430FR2633 microcontroller with CapTIvate touch technology, which provides the highest resolution capacitive-touch solution in the market. MSP MCUs with CapTIvate technology are the industry’s lowest power capacitive touch MCUs with 10 V rms noise immunity and support for dirt-proof, glove-friendly designs.
Features and benefits of the development kit:
Modular Design
- Different sensing panels can be attached through a common connector.
- The programming/debug logic has been split from the target MCU, unlike a typical LaunchPad which has both components on one PCB. This allows for an isolation module to be inserted between the two for testing/tuning, or for the programming/debug module to be used for in-system product development.
- The target MCU PCB features BoosterPack™ plug-in board headers, allowing it to be used as a BoosterPack for another LaunchPad™ development kit, such as the MSP-EXP432P401R LaunchPad kit.
Application Oriented
- The sensing panels included in the kit are designed to mimic real applications.
- Evaluating a new application simply involves laying out a basic 1 or 2 layer PCB with a footprint for the sensor connector, or simply laying out electrodes with copper tape and wiring them into the connector.
Easy Access to Data
- EnergyTrace technology power profiling enables capturing of power profiles without any measurement equipment.
- The HID-Bridge communications interface allows easy debug data transfer between the target and a PC over UART or I2C.
