HomeIndustryAerospace and DefenceArconic Collaborates with Airbus to supply 3D Printed Metal Parts

    Arconic Collaborates with Airbus to supply 3D Printed Metal Parts

    Global leader in technology, engineering and advanced manufacturing, Arconic, has entered into two contracts with Airbus to supply 3D printed metal parts for the airplane maker’s commercial aircraft. The company will supply 3D printed components made from high temperature nickel superalloys, and 3D printed titanium airframe parts under two separate agreements.

    “We’re proud to deepen our partnership with Airbus through these agreements,” said Klaus Kleinfeld, Chairman and CEO of Arconic. “Airbus’s confidence in our additive manufacturing capabilities is grounded in Arconic’s comprehensive strengths—from aerospace know-how to metals powder production and product qualification expertise. We are pleased to support our customers and pave the way to the future of aerospace manufacturing.”

    Arconic will supply 3D printed ducting components made of high-temperature nickel superalloys for the A320 family of aircraft. Advanced nickel superalloys offer superior heat resistance for these components, which flow hot air from the aero engine to other parts of the airframe.

    Under a second deal, Arconic will supply 3D printed titanium airframe brackets, also for the A320 platform. Arconic expects to deliver the first parts under both agreements in the second quarter of 2017.

    These agreements build on Arconic’s April 2016 deal with Airbus for 3D printed titanium fuselage and engine pylon components. That agreement established Arconic as an innovation partner to Airbus in the fast-growing metal 3D printing space.

    Arconic’s comprehensive capabilities, from materials science and additive manufacturing expertise, to aerospace parts qualification experience and supply chain management are helping to grow our partnership with Airbus. These latest deals will draw on Arconic’s full range of 3D printing technology capabilities, including laser powder bed and electron beam processes.

    Further details on these agreements with Airbus were not disclosed.

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    TI’s new power-management solutions enable scalable AI infrastructures

    Texas Instruments (TI) debuted new design resources and power-management...

    ESA awards Rohde & Schwarz for contributions to 30 years European Satellite Navigation

    The event brought together institutional and industrial partners, ESA...

    STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption

    STMicroelectronics, a global semiconductor leader serving customers across the...

    STARLight Project chosen as the European consortium to lead in next-gen silicon photonics on 300 mm wafers

    The STARLight project is bringing together a consortium of leading...

    KYOCERA AVX RELEASES NEW KGP SERIES STACKED CAPACITORS

    KYOCERA AVX released the new KGP Series commercial-grade stacked...

    Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

    Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth,...

    Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

    Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute...

    NEPCON ASIA 2025: Showcasing the Future of Smart Electronics Manufacturing

    NEPCON ASIA 2025, taking place from October 28 to...

    Renesas Expands Sensing Portfolio with 3 Magnet-Free IPS ICs & Web-Based Design Tool

    New Simulation & Optimization Platform Enables Custom Coil Designs...

    IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

    The IEEE International Electron Devices Meeting (IEDM) is considered...