Microchip’s PIC32A Microcontrollers Empowering the Next Generation of Embedded Systems
The embedded systems landscape is evolving rapidly in demand for AI/ML capabilities, real-time data processing and security, coasting microcontroller manufactures down a path to...
Fully automatic protective coating inspection now also on both sides and simultaneously
Expansion of the Multi Line platform with high-resolution color camera module and oblique view cameras for the inspection of protective coatings (CCI)
Protective coatings ensure...
Nuvoton Launches Highly Efficient AI MCU Deployment Tool “NuML Toolkit” to Accelerate Embedded Intelligent Application Implementation
An Integrated Tool Tailored for Engineers, Enabling Fast AI Model Deployment to MCU
As AI technology rapidly integrates into various embedded systems, how to efficiently...
Hongfa compact active suspension power design will transform driving
High-density power modules and 48V power delivery network enable midrange vehicles to adopt luxury feature
Xiamen Hongfa Electroacoustic Co., Ltd (Hongfa) has designed the...
TI teams with NVIDIA to bring efficient power distribution to AI infrastructure
What’s new
Texas Instruments (TI) announced it is working with NVIDIA in the development of power management and sensing technologies for will help enable NVIDIA’s...
Nuvoton Releases 4th Generation of “Gerda,” the Automotive HMI Display IC Series in 3 Variants
Nuvoton Technology Corporation Japan (NTCJ) will start a series production of automotive
HMI display IC "Gerda", 4th generation, which are 3 types (Gerda-4M/ Gerda-4L/...
WORKS Integration – the data center for intelligent manufacturing
ASMPT presents central platform for data exchange in electronics manufacturing.
“WORKS Integration ensures that all production data is available exactly where it is needed for...
Rohde & Schwarz Satellite Industry Day 2025: Connecting the world with New Space and 5G NTN technologies
Rohde & Schwarz is hosting its fifth Satellite Industry Day on June 3, 2025. Rohde & Schwarz test and measurement experts and partners from...
Vishay Intertechnology 80 V MOSFET in PowerPAK 8x8SW Package Offers Best in Class RDS(ON) of 0.88 mΩ to Increase Efficiency
Space-Saving Device Offers Low Max. RthJC of 0.36 °C/W and Wettable Flanks to Improve Thermal Performance and Solderability in Industrial Applications
To provide higher efficiency for...
Unlocking India’s High-Tech Security Potential: R&S India MD Yatish Mohan on Localisation, Innovation & Market Momentum
In an energetic discussion with Yatish Mohan, Managing Director, India at Rohde & Schwarz (R&S), a vision stood out: fusing leading-edge global technology with...
