HomeTechnologyArtificial IntelligenceFrom Compute to Memory: Redefining AI Performance with Next-Gen Memory and Storage

    From Compute to Memory: Redefining AI Performance with Next-Gen Memory and Storage

    Artificial Intelligence has come a long way, transforming what was once called a far-fetched notion into a makeover across industries. The conscious discourse has always been about computing accelerators such as CPUs, GPUs, or NPUs, while an invisible, but equally important, element is quietly shaping the future for AI: memory and storage. At Micron, this shift in perception has only served to deepen our commitment to innovation with a fresh standpoint whereby memory and storage became no longer just supporting elements but key drivers influencing AI in performance, scalability, and efficiency.

    Breaking Through the Memory Wall

    Scaling AI models into billions and even trillions of parameters makes the need for high-speed access to data shoot up exponentially. This really brings to the fore the age-old memory wall problem-the ever-widening gap between the fast processor and the comparatively slower memory bandwidth/latency. For AI workloads, in particular, large-scale training and inference, this can very well be a serious bottleneck.

    Micron is attacking this challenge head-on through a full suite of products that ensure memory and storage become accelerators rather than impediments for AI performance.

    Micron’s AI-Ready Portfolio

    Near Memory: High Bandwidth Memory (HBM) and GDDR reduce latency and ensure fast access to AI model parameters by closely integrating with CPUs.

    Main memory that balances capacity, low latency, and power efficiency for workloads like training and inference includes DIMMs, MRDIMMs, and low-power DRAM.

    Expansion Memory: By increasing scalable memory capacity, Compute Express Link (CXL) technology reduces total cost of ownership.

    High-performance NVMe SSDs and scalable data-lake storage are two storage alternatives that can be used to meet the I/O needs of AI applications that depend significantly on data.

    These innovations come together to form Micron’s AI data center pyramid, which increases throughput, scalability, and energy efficiency by addressing bottlenecks at every level.

    Why AI Metrics Are Important

    AI performance is assessed using common system-level KPIs across platforms, including mobile devices and hyperscale data centers:

    Time to First Token (TTFT): The speed at which a system starts producing output.

    A metric for inference throughput is tokens per second.

    A measure of power efficiency is tokens per second per watt.

    Memory and storage both have a significant impact on these parameters, guaranteeing that AI workloads are carried out quickly, reliably, and with the least amount of energy consumption.

    Enhanced Central AI Memory and Storage Set Up

    The very frontier that used to separate compute from memory is getting blurred. Given the blend of demand for energy-efficient yet high performing solution, LPDDR and other low-power memories that were being used in mobile are now gradually entering into the data center space. Micron’s portfolio of DDR, LPDDR, GDDR, and HBM memories is marketed to new levels of being optimized for every step of AI inference-from embedding to decoding, thus eliminating bottlenecks.

    Conclusion:

    AI is being viewed as the era for bigger models and faster processors; it is a point of rethinking compute, memory, and storage interoperability. Memory is indeed a performer in the guest list of AI scalability and efficiency, thanks to the DRAM and NAND memory innovations from Micron. Breaking memory wall and setting new system-level metrics will help make the next step for AI performance, thanks to Micron.

    (This article has been adapted and modified from content on Micron.)

    Related News

    Must Read

    PerfektBlue: Bluetooth Vulnerabilities Put Millions of Vehicles at Risk

    Researchers uncover a chain of flaws in a widely...

    India’s Export Growth Hits 6.18% in Early FY 2025–26, Driven by Electronics, Pharma, and Gems

    During the first five months of FY 2025–26, notwithstanding...

    TI unlocks premium motor control in everyday applications with ultra-low-cost real-time MCUs

    An expansion of TI’s comprehensive C2000 portfolio, the new...

    Establishing a Robust and Flexible Framework for Post-Quantum Security

    Given the rapid advances in quantum computing, it is...

    How Advanced Automation Drives Industrial Adoption of Small Modular Reactors

    Industries worldwide are urged to decarbonize but unable to...

    NOISE AND TVS MOTOR COMPANY PIONEER INDIA’S FIRST EV SMARTWATCH INTEGRATION

    Unveils a Made-in-India, industry-first innovation, turning the smartwatch...

    Infineon expands XENSIV MEMS microphone lineup delivering best-in-class audio and power performance

    Infineon Technologies AG has expanded its XENSIV MEMS microphone...

    New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration

    Microchip launches six variants targeting high-growth motor drive, data...