HomeTechnologyOptical inspection system for a complete 3D sintering paste check

    Optical inspection system for a complete 3D sintering paste check

    Future-proof quality assurance for power electronics through sintering paste inspection with multi-line SPI

    Higher operating temperatures, thinner interconnection layers, 10 times the longevity – the advantages of sintering pastes over solder pastes have long been recognized in the field of power electronics. Not least for this reason, sintering pastes are preferred in system-critical technologies such as “green energy” and e-mobility. Here, for example, IGBTs have become the central component in converters for all types of electric drives: wind turbines, solar power generation, battery charging – hardly any future technology would be conceivable without the “all-rounder” sintering paste. However, sintering is more prone to errors than soldering paste printing. Furthermore, defects are more difficult to detect and rectify – critical failures in the field are the result. To avoid this, GÖPEL electronic has now added an inspection system specifically for sintering paste to its Multi Line platform.

    The Multi Line SPI is a cost-effective 3D inline system for automated inspection of sintering paste. Based on the Multi Line platform, it is a customized solution for small and medium-sized companies with high quality standards; it can also be used for solder pastes. The telecentric 3D camera module is used to inspect solder and sinter paste without shadows for shape, area, coplanarity, height, bridges, volume and X/Y offset. Equipped with two digital fringe projectors for shadow-free 3D image capturing, it has a resolution of 15µm/pixel, a height measurement accuracy of 1µm and a height resolution of 0.2 µm. This means that measurement values can be obtained precisely and repeatedly.

    Generation of an inspection program for sinter paste inspection takes only a few minutes: CAD data or a reference layout is sufficient. Users who already use GÖPEL electronic software for programming SMD, THT or CCI systems can learn the additional sinter paste functions with little training. In addition, the data import, verification and statistics software are identical to the other inspection systems from GÖPEL electronic. This is where the platform concept of the Multi Line series really pays off: the uniform, powerful operating and evaluation software across all devices reduces training and programming effort, enabling flexible and optimized staff deployment planning.

    Related News

    Must Read

    ROHM Strengthens Supply Capability for GaN Power Devices

    Combining TSMC’s Process Technology to Build an End-to-End, In-Group...

    element14 Community launches smart security and surveillance design challenge

    element14, an Avnet Community, in collaboration with ADI, has...

    R & S and LITEON demonstrate high‑throughput 5G femtocell testing with the PVT360A

    Rohde & Schwarz and LITEON collaborate to showcase a...

    Infineon presents MCU and sensor solutions for the future of AI, IoT, mobility, and robotics

    Next-generation embedded systems are essential for applications in the...

    R&S advances AI-RAN testing using digital twins in collaboration with NVIDIA

    Rohde & Schwarz will showcase a new milestone in...

    Top Seven Tech Trends in the semiconductor sector for 2026

    By: STMicroelectronics In 2026, a new class of intelligent machines...

    Keysight launches next-gen Infiniium XR8 Oscilloscopes for faster analysis, clearer insights, and a compact design

     Keysight Technologies introduced its next-generation Infiniium XR8 Real-Time oscilloscopes,...

    R&S showcases its comprehensive embedded systems test solutions at embedded world 2026

    Rohde & Schwarz will present its advanced test and...