Press Release

    iWave Systems releases the world’s first PCIe to SD bridge module in M.2 type 2280...

    iWave Systems announces its all-new PCIe to SD bridge module in M.2 form factor, featuring flexible integration and excellent compatibility with existing infrastructures. M.2, an...

    STMicroelectronics and Soitec cooperate on SiC substrate manufacturing technology

    STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and Soitec (Euronext Paris), a leader in designing and manufacturing innovative...

    Electroninks Partners with Citrine Informatics to Develop Enhanced Silver Ink Using AI-Assisted R&D

    Electroninks Inc., the leader in particle-free conductive metal inks and advanced materials, today announced a redevelopment of their signature particle-free silver ink for aerosol...

    Renesas’ New Programmable Clock Generator Delivers Industry’s Best Combination of Programmability, Power, Jitter, and Size

    Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the VersaClock 7 clock generators, a family of configurable clock generators with an...

    TI expands Space-Grade Product Portfolio with Radiation-Hardened and Radiation-Tolerant Plastic Packages for Missions from New...

    Texas Instruments (TI) has announced an expansion in its portfolio of space-grade analog semiconductor products in highly reliable plastic packages for a diverse range...

    Infineon launches SLC26P Security Controller based on 28 nm Technology node for Payment applications; enables...

    Commercial production of integrated circuits using 28 nm technology nodes began several years ago. As the process technology has matured, market demand for 28...

    Infineon and TSMC to introduce RRAM technology for automotive AURIX TC4x product family

    Infineon Technologies AG  and TSMC today announced the companies are preparing to introduce TSMC’s Resistive RAM (RRAM) Non-Volatile Memory (NVM) technology into Infineon’s next-generation...

    Infineon and Fingerprints step into cooperation on the all-in-one solution SECORA Pay Bio that will...

    Infineon Technologies AG and Fingerprint Cards AB today announced the signing of a joint development and commercialization agreement for a plug-and-play turnkey solution for...

    EasyPACK 4B enables single module solution for the world’s largest 352 kW photovoltaic string inverter

    Infineon Technologies AG recently added EasyPACK 4B to its industry-leading Easy power module family. The lead type of the new family targets applications in...

    Electronica 2022 behind the scenes: What the smart mobility live stream didn’t show you!

    Audi OLED The demonstration by Audi shows what type of effects a headlight can produce when using a powerful LED driver. The L99LDLH32 is a 32-channel LED driver...

    Infineon launches the industry’s first PFC and hybrid flyback combo IC driving performance in GaN-based...

    USB power delivery (USB-PD) has emerged as the prevailing standard for fast charging and for supplying power to all kinds of mobile and battery-powered...

    KLEVV Introduces Three New M.2 NVMe SSDs to the Market

    Aimed at Enthusiasts to Mainstream Market KLEVV, an emerging memory brand introduced by Essencore, is excited to announce three new consumer-grade M.2 NVMe SSDs, the...

    Mouser Powers Exchange of Ideas at India Electronics Week 2022

    Mouser Electronics, the New Product Introduction (NPI) leader with the widest selection of semiconductors and electronic components, is proud to be the Networking Partner...

    Infineon achieves ISO/SAE 21434 process certification; AURIX TC4xx microcontroller family first to be standard-certified

    Introduced by the United Nations Economic Commission for Europe (UNECE), the new UN R155 regulation addresses the increasing focus on cybersecurity in connected automobiles....

    ROHM, Mazda, and Imasen Sign a Joint Agreement to Develop Inverters for e-Axle Using ROHM...

    ROHM has signed a joint development agreement with Mazda Motor Corporation (Mazda) and Imasen Electric Industrial Co., Ltd., (Imasen) for inverters and SiC power...

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