To strengthen India’s semiconductor manufacturing ecosystem across different stages of the value chain, Tata Electronics signed seven Memorandums of Understanding (MoUs) with global companies and Indian institutions during SEMICON India 2026, held in New Delhi from September 17 to 19. The collaborations cover wafer manufacturing, assembly and testing, advanced semiconductor packaging, materials, technology development, supply-chain localisation and talent development.
One of Tata Electronics’ major collaborations is with Nexperia, a Dutch semiconductor company. This partnership covers front end wafer fabrication, back-end assembly, and testing along with technology and ecosystem development. As per the partnership, Nexperia’s semiconductor products are expected to be manufactured and packaged through Tata Electronics’ facilities located in Dholera, Gujarat and Jagiroad, Assam.
Tata Electronics’ second collaboration is with Fujifilm, a Japanese multinational company, with the primary goal of developing a semiconductor materials ecosystem in the Dholera fabrication facility to enhance supply chain resilience. These materials include high-purity process chemicals and raw materials such as photoresists, CMP slurries, and thin-film solutions. Fujifilm plans to invest ₹800 crore to establish a semiconductor materials plant in Dholera to support the localisation of semiconductor materials.
Another important partnership is with Enomoto, a Japanese steel manufacturing company signed with Tata Electrics to strengthen its semiconductor packaging materials supply chain facility in Jagiroad, Assam. Enomoto will support Tata Electronics by providing manufacturing expertise for developing next-generation semiconductor packaging capabilities.
This collaboration of Tata Electronics with global partners reflects the effort to develop an integrated semiconductor ecosystem in India, supporting Tata Electronics’ planned fabrication facility in Dholera and semiconductor packaging facility in Assam while building domestic capabilities across the semiconductor value chain.
