HomeElectronicsRohde  and Schwarz Leads GCF 3GPP NR-NTN Validation with Record Test Cases

Rohde  and Schwarz Leads GCF 3GPP NR-NTN Validation with Record Test Cases

Rohde & Schwarz is driving the commercialization of 5G-based New Radio non-terrestrial networks, with successful certification of the highest number in GCF conformance test cases for NR-NTN to date. The validation covers all three domains, RF, RRM, and PCT.

Following the successful validation of the first 5G-based NR-NTN at the PTCRB (PCS Type Certification Review Board), Rohde & Schwarz continues its efforts to enable validation at the GCF (Global Certification Forum). The validated test cases within GCF WI-555 (Work Item) are defined in accordance with the 3GPP test specifications for RF (Radio Frequency), RRM (Radio Resource Management), and PCT (Protocol Conformance Testing) and were executed with Rohde & Schwarz conformance test solutions.

All measurements were conducted on the R&S TS8980 Conformance Test Platform, the R&S TS-RRM, and the CMX500 in frequency range 1 (FR1), verifying the latest NR-NTN chipset from Samsung as the device under test (DUT).

3GPP conformance testing is essential for ensuring that devices and networks comply with global standards. 5G NR-NTN testing presents challenges that extend beyond those encountered in traditional terrestrial networks, primarily due to the vastly different operating environment and the dynamic nature of satellite-based communication.

At the core of the Rohde & Schwarz conformance test solutions is the CMX500 5G one-box signaling tester, which also supports early research and development through integrated fading and channel emulation, along with an intuitive tool for visualizing satellite constellations – all in a single-box test setup. In addition, the user-friendly R&S CONTEST test system software platform facilitates the seamless execution of 3GPP test cases.

Related News

Must Read

Keysight Introduces RF Signal Analyzers

New analyzers help engineers capture more signal behavior with...

Murata Brings 3D EM and Thermal Simulation Models to Ansys

Murata Manufacturing Co., Ltd. announces a new collaboration with...

Microchip’s Nantes Facility Achieves QML Class Y Certification

Microchip Technology announces that its Nantes facility in France expands...

Vishay Intertechnology Releases New 1 A, 2 A, and 3 A Gen 7 1200 V FRED Pt Hyperfast Rectifiers in SMPC HV Package

Reducing Switching Losses and Increasing Efficiency, Devices Combine Low...

ROHM Launches AG16xFNxx Series MOSFETs for Automotive 48V Power Supply Systems

ROHM develops the “AG16xFNxx Series,” a lineup of 80V...

STMicroelectronics High-Performance Vibration Sensor offers an alternative to Piezosensors

Industrial-grade vibration sensor delivers the latest wide-bandwidth and...

Bosch Accelerates Automation and Robotics Drive

Advance robotics and the dynamic growth of humanoid systems...

AI server Boards are Boosting at ASMPT SMT Solutions

Solutions, a global technology manufacturer of hardware and software....

Bosch Introduces Third-Gen Silicon Carbide Chips for EV

As India accelerates its transition to electric mobility, the...

Vishay Extends ILHB Ferrite Beads for Wider Automotive EMC Support

Vishay Intertechnology, Inc. announces an expansion of its ILHB...