EU Privacy Rules Can Cloud Your IoT Future
When technology companies and communication service providers gather together at the Mobile World Congress (MWC) next week in Barcelona, don’t expect the latest bells-and-whistles...
University of Texas Designs Single-Chip Atomic Force Microscope
Researchers at the University of Texas at Dallas have designed the fully actuated probe stage of an atomic force microscope (AFM) on a single...
New Multimeter by RS Components, with guided measurement technology
RS Components has released the DM284 digital multimeter and thermal imager, which is aimed at maintenance engineers, panel builders and electricians.
The new device is...
Latest PIC MCU family by Microchip brings ease in designing
The PIC16F15386 family, the most powerful launching point into the 8-bit PIC microcontroller (MCU) portfolio, is now available from Microchip Technology Inc., a leading provider of...
High-Power Efficiency: Wolfspeed Expands Third-Generation MOSFET Platform to 1200V
Wolfspeed, a Cree Company and a leader in silicon carbide (SiC) power products, has expanded its innovative C3M platform through the introduction of a...
element14 Expands its BeagleBoard.org Product Range Appealing to Both Makers and Industrial Markets
element14, is now shipping three new products in the successful open source BeagleBone range. The ever popular BeagleBone Black and element 14 BeagleBone Black...
Smart Meters Market worth $18.2 Billion by 2019
The report "Smart Meters Market by Type (Smart Electric Meters, Smart Water Meters, Smart Gas Meters), by End User (Industrial & Commercial and Residential),...
NI Announces the Next-Gen USRP SDR devices for Design, Prototyping and Deployment
Introducing the latest additions to the most complete and scalable line of software defined radio (SDR) solutions available for aerospace, defense and wireless prototyping...
Buy at Digi-Key: TE Connectivity’s DEUTSCH Industrial & Commercial Transportation Connectors
Digi-Key Electronics, a global electronic components distributor, announced on February 22, 2017, an expanded inventory now offering DEUTSCH industrial environmentally sealed electrical connectors from...
SPIE US Conference: Leti to Present Latest R&D Results On Three Alternatives to EUV and 193nm Lithography
Leti is developing technologies for directed self-assembly lithography (DSA), massively parallel electron beam lithography and nanoimprint lithography. This is in keeping up with its...
