Unveiling the latest next-generation cloud-connected development kits with mesh-enabled networking
element14 is now shipping Particle, a range of next-generation cloud-connected development kits with mesh-enabled networking, making it possible to extend your sensor mesh network and get...
Brand new high deflection thermal gap filler reduces stress on sensitive components
Laird Performance Materials has developed Tflex HD80000, a high deflection thermal gap filler combining 6 W/mK thermal conductivity with superior pressure versus deflection characteristics....
Global Semiconductor Assembly and Testing Services market revenue to expand at 4.7% till 2027
The global semiconductor assembly and testing services (SATS) market was valued at US$ 27,700 Mn in 2016, and is expected to register a CAGR of 4.7%...
Companies join hands to develop Quantum eFPGAs on Silicon Process
Efinix, an innovator in programmable product platforms and technologies, and Samsung Electronics announced a partnership to develop Quantum eFPGAs on Samsung’s 10nm silicon process.
“It’s a...
Dynamic Power Device analyzer introduced with double-pulse test capability
Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced a...
All new Cloud ready solutions will make deployment of AIoT and cloud-connected networks easier
AAEON, an industry leading developer of edge computing platforms, is proud to announce our development of IoT platform solutions featuring Microsoft’s IoT Plug and...
New CoolSiC Schottky diode portfolio provides higher efficiency for EV DC charging
Infineon Technologies AG is extending the CoolSiC Schottky 1200 V G5 diode portfolio with the release of a TO247-2 package. It can easily replace...
India’s leveraging Tech ecosystem paves the way for NB-IoT
Recently, NB-IoT has become one of the most disruptive technologies and has shown a broad spectrum of capabilities and great potential for the Internet...
Ixia enables China Mobile to complete first 800 GE Firewall Test
Keysight Technologies, Inc., a leading technology company that helps enterprises, service providers and governments accelerate innovation to connect and secure the world, announced that...
Companies join hands to develop edge computing platform as an Intel Select Solution for uCPE
ADLINK Technology, Inc., a global provider of advanced Edge Computing products, announces that it is collaborating with Intel to develop its latest Edge Computing platform MECS-6110...
