KEC, Powernet & Wise Integration Co-Develop AI Server SMPS Power Solutions
Wise Integration (France), Powernet (Korea) and KEC (Korea) will co-develop next-generation switched-mode power supply (SMPS) solutions designed specifically for AI server applications in South...
FAMES Pilot Line R&D Advances: 400°C CMOS Enables 3D Integration Goals
CEA-Leti, the coordinator of the FAMES Pilot line, has achieved a major milestone for next-generation chip stacking: fully functional 2.5 V SOI CMOS devices fabricated...
Keysight & KT SAT Nail Industry First GEO-to-LEO Multi-Orbit NTN Handover!
Keysight Technologies, Inc., in collaboration with KT SAT, has demonstrated a successful non-terrestrial network (NTN) handover using the KOREASAT-6A satellite at KT SAT’s Kumsan...
Nuvoton Emphasises Need to Strengthen Taiwan-Israel R&D Collaboration
Nuvoton Technology showcased its leadership in international expansion by participating in the “Israeli-Taiwanese Business Seminar,” hosted by the Economic Division of the Taipei Economic...
element 14’s DevKit HQ: A One Stop Development Kit Solution
Engineering is all about trying and testing. According to a survey conducted by element 14, most engineering professionals feel that finding the right development...
USB-IF Hardware Certification to Anritsu for USB4 2.0 Test Solution
ANRITSU CORPORATION gets certified by the USB Implementers Forum (USB-IF) for its test solution for the latest USB4 Version 2.0 (USB4 v2) communication standard.
The solution...
Kyocera and Rohde & Schwarz’s multipurpose phased array antenna module (PAAM) at CES 2026
Kyocera and Rohde & Schwarz will demonstrate the characterization of Kyocera’s novel phased array antenna module (PAAM) at CES 2026 in Las Vegas, NV....
UP’s Semiconductor Push: State to Build Three New Electronics Hubs Beyond NCR
With an aim to boost development and employment beyond the traditional Noida-Greater Noida belt, the UP government is planning to set up three semiconductor...
CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration at IEDM 2025
CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...
New, Imaginative AI-enabled satellite applications through Spacechips
As the demand for smaller satellites with sophisticated computational capabilities and reliable along with robust onboard processor systems to support the five to ten-year...
