Infineon announces CoolGaN bidirectional switch and CoolGaN Smart Sense for higher performance and more cost-effective power systems
Infineon Technologies AG today announced two new CoolGaN product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS provides exceptional soft- and...
Rohde & Schwarz approved by USB-IF for USB 3.2 Gen 1 & Gen 2 transmitter and receiver compliance testing
The USB Implementers Forum (USB-IF) has approved the USB 3.2 Gen 1 & Gen 2 transmitter and receiver compliance test solution from Rohde &...
E-Fill Electric Joins Forces with DevvStream to Drive Carbon Credit Generation from India’s EV Charging Network
Strategic Partnership Aims to Generate Carbon Credits from EV Charging Network, Revolutionizing India’s Electric Mobility Landscape.
As the world celebrates World Environment Day, E-Fill Electric,...
u-blox launches comprehensive Bluetooth Angle-of-Arrival solution to enable reliable indoor asset tracking
u-locate offers every necessary hardware, software and middleware component for indoor positioning, including support for interoperability with the omlox™ standard.
u-blox, a global provider of...
New industrial CoolSiC MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power density
The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization...
TRI to Drive AI Innovation in Smart Factories, in Collaboration with NVIDIA
Test Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, today announced a collaboration with NVIDIA and leading Taiwanese...
Introducing the TimeProvider XT Extension System for Migrating to a Modern Synchronization and Timing Systems Architecture
Accessory device to Microchip’s TimeProvider 4100 grandmaster scales up to 200 fully redundant T1, E1 or CC synchronization outputs
Critical infrastructure communication networks require...
STMicroelectronics to build the world’s first fully integrated silicon carbide facility in Italy
New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania,...
Enhancing Data Security With the CEC173x Family’s SPI Monitor Feature
Courtesy: Microchip
The Role of CEC173x’s SPI Monitor in Ensuring Secure Data Transmission
In the dynamic landscape of electronic devices, data integrity and security are paramount...
Upgrading Lam Tools Reduces Carbon Footprint for Customers
Courtesy: Lam Research
A key component of Lam’s strategy is improving the energy efficiency of our products
Upgrades to installed systems realize immediate reduction...
