KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is thrilled to announce an unprecedented leap in reflow process inspection (RPI) technology. General Manager Miles Moreau will be presenting an exclusive lecture at productronica on Wednesday, November 15, 2023, at the productronica Forum, unveiling the remarkable “Real-time production reflow profile inspection, with new sensor technology for heat transfer detection.”
In today’s dynamic manufacturing environment, maintaining the highest level of quality and process control is imperative. RPI, or reflow process inspection, is a critical element, alongside SPI and AOI, in realizing real-time process control throughout the assembly line. KIC is proud to introduce NEW SENSOR TECHNOLOGY that adds significant value to reflow process inspection by directly measuring board temperatures during production. This technology detects changes in heat transfer, thus marking a revolutionary advancement in electronics manufacturing. Moreau will discuss:
- Reflow Process Inspection and its significance
- Introduction to the groundbreaking Heat Transfer technology
- Sensing technology’s added value in the realm of RPI
- Detecting heat transfer changes in convection
- The role of pyrometers in detecting board jams, board drop, and incorrect recipes
The Evolution of Reflow Process Inspection (RPI): Reflow Process Inspection (RPI) has been a cornerstone of precision and automation in thermal processes within reflow ovens. Developed by industry leader KIC, RPI systems have been synonymous with reliability and quality in electronics manufacturing. KIC’s RPI system comprises embedded sensors that monitor temperature, conveyor speed, and PCBAs as they traverse the oven. By continuously monitoring and calculating temperature profiles, RPI eliminates manual interventions, reduces downtime, and ensures consistent PCB quality.
Introducing Cutting-Edge Sensing Technology: KIC is proud to introduce a groundbreaking sensing technology that directly measures board temperature at the end of the heated oven section during production. This direct measurement capability enables real-time monitoring of temperature and convection changes. It’s a revolutionary leap in reflow process inspection technology.
Benefits of the New Sensing Technology:
- Precision Redefined: Directly measuring board temperature and heat transfer changes during production ensures unparalleled precision and quality in reflow profiles, monitoring all aspects of the oven’s influence on production boards.
- Combined Board-Level Temperatures: KIC RPI employs advanced algorithms that consider board temperature and ambient temperature at board level to determine temperature, time, and heat transfer changes impacting the reflow profile.
- Seamless Integration: Our RPI system actively tracks process Cpk, providing critical temperature profile data that seamlessly integrates with other MES factory automation systems, SPI, and AOI data.
Experience the Future of Electronics Manufacturing: Discover the future of electronics manufacturing with our advanced RPI systems equipped with this revolutionary sensing technology. Stay ahead of the competition, enhance process efficiency, and ensure uncompromised quality in every PCB.
Ready to Elevate Your Manufacturing Quality and Process Control? Contact us today to explore how KIC’s new heat transfer detection and advanced sensing technology can enhance your manufacturing quality and process control.
Visit KIC at Hall A4.214, during productronica 2023 to engage with thermal process experts, learn more about this groundbreaking technology, and explore solutions for soldering and curing processes in electronics manufacturing and semiconductor advanced packaging.
