Press Release

Infineon leads the way in decarbonization with Product Carbon Footprint data for customers

 Infineon takes a pioneering role in the semiconductor industry and creates transparency for its customers regarding the climate impact of individual product families ...

Rohde & Schwarz and VIAVI offer joint network test solutions supporting Open Radio Commercialization and...

The United States Department of Commerce will provide funding to promote the deployment of open networks in the U.S. and abroad. Rohde & Schwarz...

Geely Auto Gears up NEV Transformation and Innovation with Long-Term SiC Supply Agreement and Joint...

ST’s third-generation SiC MOSFETs help increase the powertrain efficiency for Geely Auto Group battery electric vehicles. Innovation Joint Lab was set up to...

Infineon presents new 600 V CoolMOS 8 SJ MOSFET family for advanced and cost-effective power...

Infineon Technologies AG introduces the 600 V CoolMOS 8 high voltage superjunction (SJ) MOSFET product family. The devices combine the best features of the...

Vishay Intertechnology Releases Second-Generation Automotive Grade IHLE® Inductor With Integrated EMI Shield in 4040 Case...

Improved Shield Design Delivers Higher Voltage Ratings, Up to 20 dB of Radiated E-Field Reduction, and Polarity Marking for Additional EMI Control Vishay Intertechnology, Inc....

Infineon announces CoolGaN bidirectional switch and CoolGaN Smart Sense for higher performance and more cost-effective...

Infineon Technologies AG today announced two new CoolGaN product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense. CoolGaN BDS provides exceptional soft- and...

Rohde & Schwarz approved by USB-IF for USB 3.2 Gen 1 & Gen 2 transmitter...

The USB Implementers Forum (USB-IF) has approved the USB 3.2 Gen 1 & Gen 2 transmitter and receiver compliance test solution from Rohde &...

E-Fill Electric Joins Forces with DevvStream to Drive Carbon Credit Generation from India’s EV Charging...

Strategic Partnership Aims to Generate Carbon Credits from EV Charging Network, Revolutionizing India’s Electric Mobility Landscape. As the world celebrates World Environment Day, E-Fill Electric,...

u-blox launches comprehensive Bluetooth Angle-of-Arrival solution to enable reliable indoor asset tracking

u-locate offers every necessary hardware, software and middleware component for indoor positioning, including support for interoperability with the omlox™ standard. u-blox, a global provider of...

New industrial CoolSiC MOSFETs 650 V G2 in TOLT and Thin-TOLL package increase system power...

The electronics industry is witnessing a significant shift towards more compact and powerful systems, driven by technological advancements and a growing focus on decarbonization...

TRI to Drive AI Innovation in Smart Factories, in Collaboration with NVIDIA

Test Research, Inc., the leading test and inspection systems provider for the electronics manufacturing industry, today announced a collaboration with NVIDIA and leading Taiwanese...

Introducing the TimeProvider XT Extension System for Migrating to a Modern Synchronization and Timing Systems...

Accessory device to Microchip’s TimeProvider 4100 grandmaster scales up to 200 fully redundant T1, E1 or CC synchronization outputs Critical infrastructure communication networks require...

STMicroelectronics to build the world’s first fully integrated silicon carbide facility in Italy

New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania,...

Wireless IoT Designs Just Got Easier

Embedded system designs all have one thing in common: a microprocessor and controller. These can be as sparse as 4-bit wide controllers with less...

Infineon receives building permit for final construction phase of Smart Power Fab in Dresden

– Saxony's Prime Minister Michael Kretschmer hands over the last outstanding building permit for the construction project – Infineon is on schedule with the Smart Power...

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