Press Release

Accelerating the Adoption of AI Applications, Nuvoton Technology Introduces an Endpoint AI Product Platform Based...

Nuvoton Technology introduces an endpoint AI platform based on microcontrollers, expanding the AI ecosystem into the microcontroller domain. This solution is based on Nuvoton's...

Microchip Technology Expands TrustFLEX Family with CEC1736 Real-time Platform Root of Trust Devices

TrustFLEX devices along with the Trust Platform Design Suite tool will simplify the enablement of the root of trust from concept to production in...

Vertiv Joins the NVIDIA Partner Network

Vertiv brings its high-density power and cooling infrastructure expertise to the NVIDIA Partner Network to better support adoption of accelerated computing and AI workloads Vertiv,...

New SSO10T TSC top-side cooling package for power MOSFETs enables highest efficiency for modern automotive...

Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS MOSFET technology. With its direct top-side cooling concept, the package offers excellent thermal performance....

Infineon extends its XDP digital power protection controller family with the XDP700-002, the industry’s first...

Infineon Technologies AG is expanding its XDP digital power protection controller product family with the XDP700-002, the industry's first -48 V wide input voltage...

Infineon presents innovative semiconductor and microcontroller solutions for a greener future at embedded world 2024

Decarbonization and digitalization are the two central challenges of our time, but they rely on new and advanced technologies. At embedded world 2024 in...

embedded world 2024: Rohde & Schwarz presents its cutting-edge test solutions for embedded systems

Embedded systems are the foundation of today’s electronic devices, spanning sectors as diverse as consumer electronics, telecommunications, industrial, medical, automotive and aerospace applications. Ensuring...

New Renesas MCUs conserve energy with high-res analog and OTA update support

Low-Power, Streamlined Devices Target Energy Management, Home Appliances, Building Automation and Medical Applications Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced...

Cadence and NVIDIA Unveil Groundbreaking Generative AI and Accelerated Compute-Driven Innovations

Cadence Reality Digital Twin Platform integrated with NVIDIA Omniverse and Orion molecular design platform accelerated with NVIDIA BioNeMo will transform the future of design Cadence Design Systems, Inc. today announced an expansion...

STMicroelectronics Reports on Resolutions to be Proposed at the 2024 Annual General Meeting of Shareholders

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced the resolutions to be submitted for adoption at the Annual General...

Unparalleled capacitance for miniaturized designs: Panasonic Industry launches new ZL Series Hybrid capacitors

The compact and AEC-Q200-compliant EEH-ZL Series stands out with industry-leading capacitance and high Ripple Current specs The ZL series is the latest offspring of Panasonic...

DDS Option for high-speed AWGs generates up to 20 sine waves

20 independent sine waves up to 400 MHz can be controlled on one generator channel Spectrum Instrumentation has released a new firmware option for its...

MSTC 2024 to Spotlight Latest MEMS and Sensors Advances Driven by Artificial Intelligence

Keynote speakers at the SEMI MEMS and Sensors Technical Congress (MSTC 2024) will highlight smart home and smart garment innovations driven by artificial intelligence (AI) as...

300mm Fab Equipment Spending Forecast to Reach Record $137 Billion in 2027, SEMI Reports

Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027 after topping US$100 billion for the...

Infineon to complete limited Share Buyback Program serving fulfillment of obligations under existing employee participation...

Infineon Technologies AG has successfully completed its Share Buyback Program 2024, announced on 26 February 2024 in accordance with Article 5(1)(a) of Regulation (EU)...

Related News