HomeNewsInfineon Expands NFC IP and Technology Portfolio; Strengthens Leadership Position In the...

    Infineon Expands NFC IP and Technology Portfolio; Strengthens Leadership Position In the IoT markets

    Infineon Technologies AG closed the acquisition of an NFC patent portfolio from France Brevets and Verimatrix. Infineon is now the sole owner of this patent portfolio, which consists of nearly 300 patents in various countries. All patents are related to near field communication (NFC) technologies: either technologies embedded in an integrated circuit (IC) such as Active Load Modulation (ALM) or technologies that enhance NFC usability at the user level. The patent portfolio was previously monetized by France Brevets. It is now fully integrated into Infineon’s patent administration.

    “With this acquisition, Infineon further strengthens its IP and technology portfolio, specifically in our leadership markets for security and connectivity for the IoT,” said Thomas Rosteck, President of Infineon’s Connected Secure Systems division. “This expansion of our own patent portfolio highlights the excellent company positioning and its continuous investment in technology spanning several verticals. The acquired patents will not only increase our visibility in connectivity and IoT but is another step towards our IP leadership in device authentication.”

    The recently acquired patent portfolio supports easy and fast development in some of the most challenging environments, enabling innovative customer solutions. Potential use cases include IoT as well as secured identities and transactions in wearables such as wristbands, rings, watches and glasses. Patents in the acquired patent portfolio support the implementation in a booming market which ABI Research projects will surpass 15 billion NFC-enabled devices and items/products shipped between 2022-2026.

    Manufacturers of NFC devices are very often confronted with specific geometries and materials. Additionally, limiting form factors and security implementation are extending the design cycles. NFC integration in wearables for example often requires small loop antennas and specific constructions. This causes a physical boundary for the antenna size to achieve standard conformance with conventional, passive load modulation. ALM, being one technical aspect covered by the NFC patent portfolio, can help overcoming space restraints.

    For more information, visit: https://www.infineon.com/

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides extensive global coverage of Electronics, Technology and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads and market your products favourably.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...