HomeNewsIndia NewsSTMicroelectronics Drives Power-Module Miniaturization with High-Temperature Surface-Mount Silicon Controlled Rectifiers

    STMicroelectronics Drives Power-Module Miniaturization with High-Temperature Surface-Mount Silicon Controlled Rectifiers

    STMicroelectronics has introduced the industry’s first 800V surface-mount Silicon Controlled Rectifiers (SCR, or thyristor) specified for operation at temperatures up to 150°C without derating, giving freedom to miniaturize power modules for applications that demand high reliability in harsh conditions.

    newsimage_11511With its 80A current rating, the new TM8050H-8 SCR, housed in the High-Voltage D3PAK (TO-268-HV), enables mid-power applications in the 1-10kW range to leverage surface-mount assembly efficiencies and reduce PCB and heatsink sizes, lowering system cost. The package has very low junction-to-case thermal resistance of 0.25°C/W, ensuring efficient heat dissipation, and a large pin-to-tab creepage distance of 5.6mm that gives a large safety margin in the presence of high applied voltages. A TO-247 package option is also available.

    The TM8050H-8 is the latest addition to ST’s family of SCRs that all bring state-of-the-art device and package technologies to automotive and industrial power control. Spanning current ratings from 12A to 80A, the devices enable designers to create extremely compact and reliable car or motorcycle voltage regulators, induction motor starters, soft starters, industrial heater or cooker controls, Solid-State Relays (SSRs), uninterruptible power supplies (UPS), and AC-line conditioners.

    With low dynamic resistance (RD) and on-state voltage (VTO) of 5.5 mΩ (TJ = 150°C) and 0.85V respectively, and leakage current of 20µA max (at 800V, Tj = 25°C), the TM8050H-8 ensures extremely high energy efficiency under all operating conditions.

    The TM8050H-8 is in production now, priced from $2.20 in TO-247 or $2.50 in High-Voltage D3PAK.

    For further information please visit www.st.com/tm8050h-d3pak-nb

     

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Optimized analog front-end design for edge AI

    Courtesy: Avnet Key Takeaways: 01.   AI models see data differently: what...

    Introducing Wi-Fi 8: The Next Boost for the Wireless AI Edge

    Courtesy: Broadcom Wi-Fi 8 has officially arrived—and it marks a...

    Vehicle to Grid (V2G) Charging in EVs: Understanding the Basics

    Much of the research around emerging technologies in Electric...

    Asia-Pacific Takes the Lead in AI Adoption Across Manufacturing

    Courtesy: Rockwell Automation Manufacturing around the world has undergone a...

    STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

    STMicroelectronics has unveiled a secure NFC chip designed to...

    Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

    Mitsubishi Electric India, is set to introduce its flagship...

    ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market

    ASMPT announced it had won new orders for 19...

    Microchip Halves the Power Required to Measure How Much Power Portable Devices Consume

    Battery-operated devices and energy-restricted applications must track and monitor...