HomeTechnology5GAdjuring the 5G Network: VIAVI Releases Test Suite for O-RAN Specifications

    Adjuring the 5G Network: VIAVI Releases Test Suite for O-RAN Specifications

    VIAVI Solutions Inc. released updates to its industry-first Test Suite for O-RAN Specifications. The O-RAN ALLIANCE’s specifications for open radio access networks are being adopted by operators and equipment manufacturers worldwide, to reduce infrastructure costs and lower the barrier to entry for new product innovation. The test suite has been augmented to include use cases of critical importance as O-RAN becomes adopted at scale, as well as learnings from customer engagements around the globe.

    In a multi-vendor-based O-RAN environment, operators will bear the burden of ensuring conformance, interoperability, and performance. Based on its leading position validating network products for operators and manufacturers worldwide – including all Tier-1 network equipment manufacturers – VIAVI has the most comprehensive O-RAN test platform on the market, with CUSM-plane parameters used by more vendors than any other solution. The company is also active in specifications development, as the editor of interoperability test specifications in the open front haul (WG4) and open interfaces (WG5) working groups, and the co-chair of multiple working groups at the O-RAN ALLIANCE. VIAVI’s active contributions have enabled it to develop partnerships with complementary solutions from best-of-breed vendors.

    Updates to the Test Suite include:

    • O-RAN Subsystem and End-to-End Testing – proving O-RU conformance, performance, and interoperability to network operators; performance and interoperability validation of open front haul in the lab and field; validating the O-DU in a multi-vendor O-RU environment; validating F1 interface performance using an O-DU emulator; RAN Intelligent Controller and xApp mixed vendor ecosystem assurance; and end-to-end network performance, mobility, and capacity test
    • Transport Network Testing – verification of 4G and 5G front haul transport and synchronization networks
    • Network Assurance – operational assurance, troubleshooting, and optimization.

    As a key example of the best-of-breed approach, VIAVI and Rohde & Schwarz are jointly demonstrating validation of open front haul performance with the O-RAN ALLIANCE at MWC Shanghai. This demonstration will showcase the generation and delivery of typical standards-based test case IQ data to the O-RU utilizing the Lower Layer Split Option 7.2x front haul interface with the VIAVI TM500 O-RU Tester. Moreover, uplink and downlink front haul logs are captured, and RF signal generation and capture are performed using the Rohde & Schwarz vector signal generator and signal and spectrum analyzer hardware along with VSE Software for signal analysis. Testcase workflow is simplified for the end-user utilizing the VIAVI O-RU Test Manager, providing a single point of test control.

    The promise of O-RAN extends beyond the many benefits of an open ecosystem to include a solid foundation for virtualized network elements, enabling increased speed and scalability to capture the burgeoning 5G market. Yet the complexity of multi-vendor O-RAN architecture presents significant challenges for successful network development, deployment, and operation, requiring thorough validation, integration, and troubleshooting with a complete set of advanced test solutions.

     

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification

    Qualitas Semiconductor Co., Ltd., a leading developer specialising in...

    The Tomorrow for AI and India’s edge advantage

    Courtesy: Qualcomm Artificial intelligence is entering its next chapter, one...

    Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement

    Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum...

    STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform

    STMicroelectronics is now entering high-volume production for its state-of-the-art...

    Impact of AI on Computing and the Criticality of Testing

    Courtesy: Teradyne Artificial intelligence (AI) is transforming industries, enhancing our...

    Disruptions from Wide Bandgap Continue Turbulence

    Courtesy: Avnet When we experience major shifts in the technology...

    Securing Humanoid Robotics with TPM-Anchored FPGAs

    Courtesy: Lattice Semiconductor The humanoid robotics market is rapidly transitioning...

    Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres

    Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio...

    CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects

    CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled...