HomeNewsIndia NewsAnalog Devices’ MEMS Accelerometers Enable Early Detection of Structural Defects

    Analog Devices’ MEMS Accelerometers Enable Early Detection of Structural Defects

    unnamed-4Analog Devices, Inc. (ADI) on September 5, 2016, announced three-axis, MEMS accelerometers that perform high resolution vibration measurement with very low noise to enable the early detection of structural defects via wireless sensor networks. The low power consumption of the new ADXL354 and ADXL355 accelerometers lengthens battery life and allows extended product usage by reducing the time between battery changes. The low noise performance of the ADXL354 and ADXL355 with low power consumption makes it now possible to cost-effectively enable low-level vibration measurement applications such as Structural Health Monitoring (SHM). Additionally, the tilt stability of ADXL354 and ADXL355 accelerometers delivers excellent repeatability over temperature and time, which is ideal for orientation and navigation systems in unmanned aerial vehicles using Inertial Measurement Units (IMUs) and inclinometers. By providing repeatable tilt measurement under all conditions, the new accelerometers enable minimal tilt error without extensive calibration in harsh environments.

    The ADXL354 and ADXL355 accelerometers offer guaranteed temperature stability with null offset coefficients of 0.15mg/C (max). The stability minimizes resource and expense associated with calibration and testing effort, helping to achieve higher throughput for device OEMs. In addition, the hermetic package helps ensure that the end product conforms to its repeatability and stability specifications long after they leave the factory.

    With output of ±2g to ±8g full scale range (FSR), selectable digital filtering from 1 Hz to 1 kHz, and low noise density of 25µ/√Hz at less than 200µA current consumption, the ADXL354 and ADXL355 accelerometers offer performance level comparable to much more expensive devices with less power consumption and BOM cost.

    Product Pricing and Availability

                                 
    Product     Output Interface     Sample
    Availability
      Full
    Production
        Price Each
    per 1,000
        Packaging
    ADXL354     Analog     Now   Now     $25.42     6×6 mm 14-
    lead LCC
    ADXL355     SPI     Now   Now     $28.25     6×6 mm 14-
    lead LCC
    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    ECMS applications make history, cross Rs. 1 lakh crore in investment applications

    Union Minister for Electronics and IT Ashwini Vaishnaw announced...

    AI-Driven 6G: Smarter Design, Faster Validation

    Courtesy: Keysight Technologies Key takeaways: Telecom companies are hoping...

    Scaling up the Smart Manufacturing Mountain

    Courtesy: Rockwell Automation A step-by-step roadmap to adopting smart manufacturing...

    STMicroelectronics’ new GaN ICs platform for motion control boosts appliance energy ratings

    STMicroelectronics unveiled new smart power components that let home...

    Keysight Hosts AI Thought Leadership Conclave in Bengaluru

     Keysight Technologies, Inc. announced the AI Thought Leadership Conclave, a...

    Government approves 17 projects worth Rs. 7,172 crore under ECMS

    The Ministry of Electronics and IT announced for the...

    BD Soft strengthens cybersecurity offerings for BFSI and Fintech businesses with advanced solutions

    BD Software Distribution Pvt. Ltd. has expanded its Managed...

    Advancing Quantum Computing R&D through Simulation

    Courtesy: Synopsys Even as we push forward into new frontiers...

    Overcoming BEOL Patterning Challenges at the 3-NM Node

    Courtesy: Lam Research ● Controlling critical process parameters is key...