Solid Tantalum Capacitors with MnO2 Electrolyte Voltage Derating
Introduction
Solid tantalum capacitors are characterized with a “Fb” basic failure rate (FR) level. To reduce the probability of component failure, the devices should be...
Quickly Implement Spoofing-Resistant Face Recognition without a Cloud Connection
Face recognition has gained widespread acceptance for authenticating access to smartphones, but attempts to apply this technology more broadly have fallen short in other...
Thermal Management – Keeping Cool Starts From Within
Thermal management is a critical component of the design phase for any electronics device. Factoring in thermal management earlier on in the design process...
Monitoring 12-V automotive battery systems: Load-dump, cold-crank and false-reset management
The 12-V lead-acid battery is a staple in automotive electronic systems such as automotive cockpits, clusters, head units and infotainment. Monitoring the battery voltage...
IO-Link and Single Pair Ethernet, two recent networking protocols for improved industrial connectivity
The landscape of industrial networking
As industrial performance improvement initiatives such as Industry 4.0 and the industrial internet of things (IIoT) become commonplace, the need...
Isolated Gate Driver from STMicroelectronics Safely Controls Silicon-Carbide MOSFETs
Joining STMicroelectronics’ STGAP family of Isolated Gate Driver, the STGAP2SiCS is optimized for safe control of silicon carbide (SiC) MOSFETs and operates from a...
How to choose the right battery-charger IC for ultrasound point-of-care products
Advancements in ultrasound imaging technology, along with rising demand for minimally invasive diagnostics and therapeutics, have made it possible to implement ultrasound applications for...
How Do IoT Devices Communicate
Internet of Things (IoT) devices communicate is dozens of different ways, using hundreds of different protocols. That's because how they communicate depends on what...
70 kHz to 110 GHz Broadband Power Calibrations using Anritsu Power MasterTM MA24510A
Introduction
Companies are always working on the next big technology that will propel the world forward. Without a doubt, the biggest breakthroughs have occurred in...
3D Stacking for Next-Generation High Performance Energy Efficient Systems
Moore’s Law scaling is slowing down and limited improvements in performance, power, area, and cost are available from one process node to the next....
