Powering AI: How Power Pulsation Buffers are transforming data center power architecture
Courtesy: Infineon Technologies
Microsoft, OpenAI, Google, Amazon, NVIDIA, etc. are racing against each other, and it is for good reasons: to build massive data centres...
From Insight to Impact: Architecting AI Infrastructure for Agentic Systems
Courtesy: AMD
The next frontier of AI is not just intelligent - it’s agentic. As enterprises move toward systems capable of autonomous action and real-time...
The Architecture of Edge Computing Hardware: Why Latency, Power and Data Movement Decide Everything
Courtesy: Ambient Scientific
Most explanations of edge computing hardware talk about devices instead of architecture. They list sensors, gateways, servers and maybe a chipset or...
The Grid as Strategy: Powering India’s 2047 Transformation
by Varun Bhatia, Vice President – Projects and Learning Solutions, Electronics Sector Skills Council of India.
As India approaches its centenary in 2047, the idea...
Software-Defined Everything: The Foundation of the AI-powered Digital Enterprise
Courtesy: Siemens
Industry today is not facing a single technological change but a structural transformation. Markets are evolving faster than production systems, product life cycles...
3 semicon-enabled innovations impacting our experience of the world
Courtesy: Texas Instruments
The chips that power today's smartphones contain over 15 billion transistors; the semiconductors powering data centres can have hundreds of billions of...
The Next Phase of Energy Storage: When Batteries Start Working with the Grid
Authoredby: Rajesh Kaushal, Energy Infrastructure & Industrial Solutions (EIS) Business Group Head, India & SAARC, Delta Electronics India
For decades, the electricity grid operated on...
GaN Benefits in Motor Controls
By: Ester Spitale, Technical Marketing Manager, STMicroelectronics and Albert Boscarato, Application Lab Manager, STMicroelectronics
GaN benefits in different applications
The major challenge of power electronics today...
Bridging the design-to-deployment gap: How India can lead the next wave of connected device innovation
Hareesh Ramana, Chief Experience Officer, Sasken Group & President, Borqs Technologies (a Sasken Group company)
India is making significant strides in electronics manufacturing with the...
R&S drives connections and innovations at MWC Barcelona 2026
Rohde & Schwarz will exhibit its extensive portfolio of next generation of wireless technologies, under the motto, “Enabling Connections, Empowering Innovations”, at the Mobile...
