EDOM Showcases Physical AI & Robotics Applications at GTC 2026
EDOM Technology will participate in NVIDIA GTC for the third consecutive year under the theme “From AI to Action: Physical AI in Motion.” Together...
Keysight Partners with 3dB Labs to Enable Interoperable Signal Monitoring and Analysis
Keysight Technologies announced the integration of its spectrum analysers and FieldFox handheld analysers with 3dB Labs’ Sceptre, expanding interoperability between signal monitoring hardware and...
India to Boost Local Chip-making with a 1 Trillion Rupees Funding
India is expected to unveil a funding of more than a trillion rupees, nearly $10.8 billion, to fuel domestic chip-making. With 10 projects already...
Qualitas Semiconductor Picks Anritsu’s Vector Network Analyzer for High-Speed Interconnect Signal Integrity Verification
Qualitas Semiconductor Co., Ltd., a leading developer specialising in PHY IP solutions for high-speed interconnects, has adopted Anritsu’s ShockLine 4-Port Performance Vector Network Analyzer...
Posifa Technologies Introduces PVC4001-C MEMS Pirani Vacuum Transducer for Wide-Range Vacuum Measurement
Posifa Technologies has introduced its new PVC4001-C MEMS Pirani vacuum transducer, the latest device in the company's PVC4000 series. Designed for cost-effective OEM integration, the...
STMicroelectronics to support AI infrastructure demand with high-volume production of its industry-leading silicon photonics platform
STMicroelectronics is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centres and AI...
Keysight Expands Digital‑Layer Error Performance Validation for High‑Speed 1.6T Interconnects in AI Data Centres
Keysight Technologies, Inc. introduced the Functional Interconnect Test Solutions (FITS) portfolio and FITS-8CH, the suite’s first product. FITS-8CH delivers digital-layer bit error ratio (BER) and forward...
CEA-Leti and NcodiN Collaborate on 300 mm Silicon Photonics for Bandwidth-Consuming AI Interconnects
CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialise NcodiN’s optical interposer technology on a 300...
NXP CoreRide Puts Automakers on Fast Path to 48 V Scalable Zonal Architectures
NXP Semiconductors introduced its NXP CoreRide Z248 zonal reference system - the semiconductor industry’s first pre-validated, design-ready zonal foundation that combines advanced 48 V...
Everspin Launches New Generation of Unified Memory for Embedded Systems
Everspin Technologies, a leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, today announced the UNISYST MRAM family, a new generation...
