ELE Times Report

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Rohde & Schwarz collaborates with Qualcomm to test 3GPP Rel. 17 GSO and GEO satellite chipsets for IoT-NTN

Rohde & Schwarz, in collaboration with Qualcomm Technologies, Inc., will conduct a comprehensive set of tests for NB-IoT over non-terrestrial networks (NTN) to accurately...

Anritsu to Showcase 5G RedCap Testing Capability in Collaboration with Quectel at MWC Shanghai

MT8000A to Verify RedCap Module Performance in Anritsu Booth at MWC Shanghai 2023 Anritsu Corporation will demonstrate its ability to test emerging 5G reduced capability...

Hearables & Wearables industry in India set to require 5 times current manpower by 2025-26: ESSCI

ESSCI's skill gap study highlights the need for upskilling in Hearables & Wearables industry. Study reveals potential for rapid growth in Hearables &...

Creation Technologies Expands Presence in China with New State-of-the-Art Facility

Creation Technologies, an end-to-end, scalable Specialty Global Electronic Manufacturing Services provider, announced its move to a new expanded facility in Changzhou, China. The company...

Burgeoning Amount of Data in Retail Industry to Boost Adoption of Artificial Intelligence: Fact.MR Report

Fact.MR, a market research and competitive intelligence provider, reveals that the global artificial intelligence (AI) in the retail market is set to achieve a valuation of...

BTU International and Hentec/RPS Expand Partnership to Include Vector Selective Soldering Systems

Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce its distribution agreement with BTU...

PREMO’s Latest Innovative Product: BCBM-50KW-001 Module for Air-Cooled EV Charging Stations with Embedded Resonant Choke for LLC Topology.

At the heart of Premo's innovation lies a compact 50KW transformer set meticulously engineered to meet the demanding power requirements of modern EVs. Housed...

LeddarTech Releases Production Samples of the LeddarVision Front-Entry (LVF-E) Comprehensive Low-Level Fusion and Perception Software Featuring the TI TDA4VM-Q1 Processor for L2/L2+ ADAS Applications

LeddarTech’s LVF-E’s “B” sample featuring an embedded ECU introduces an unprecedented industry-first solution that brings high performance and reliability of low-level fusion to the...

Assembly Solutions Optimizes Assembly Operations with 7 Inovaxe Smart Racks

Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce that Assembly Solutions has made a...

Heraeus Electronics to introduce new advanced solutions to further elevate device performance at SEMICON China 2023

Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai...

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