HomeElectronicsCyberOptics to Launch Next-Generation WaferSense

    CyberOptics to Launch Next-Generation WaferSense

    CyberOptics Corporation will exhibit at SEMICON West 2022 HYBRID, scheduled to take place July 12–14, 2022 at the Moscone Center in San Francisco and online 24/7. The company will launch its next-generation WaferSense Auto Teaching System (ATS2) and new ReticleSense Auto Teaching System (ATSR) in Booth #1241.

    ATS2 and ATSR are multi-camera sensors used with CyberSpectrum software to teach accurate wafer and reticle hand-off­ calibration for proper alignment and set-up of semiconductor tools. The sensors “see” inside to capture three-dimensional o­ff-set data (x, y and z) in real-time to quickly teach wafer and reticle transfer positions – all without opening the tools. Process and equipment engineers can conduct repeatable and reproducible setups and maintenance checks, speed trouble-shooting and eliminate technician-to-technician variation.

    Semiconductor fabs worldwide are using our teaching sensors that are recognized as the most efficient and effective wireless devices for wafer hand-off teaching,” said Dr. Subodh Kulkarni, President and CEO, CyberOptics. “We have advanced the technology to enable even better performance, with the combination of accuracy, precision and versatility that fabs rely on to significantly improve their yields and tool uptime.”

    CyberOptics also will demonstrate WaferSense sensors for levelling, vibration, gapping, relative humidity, resistance and airborne particles.

    ELE Times News
    ELE Times Newshttps://www.eletimes.ai/
    ELE Times provides extensive global coverage of Electronics, Technology, and the Market. In addition to providing in-depth articles, ELE Times attracts the industry’s largest, qualified, and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build experience, drive traffic, communicate your contributions to the right audience, generate leads, and market your products favorably.

    Related News

    Must Read

    Can the SDV Revolution Happen Without SoC Standardization?

    Speaking at the Auto EV Tech Vision Summit 2025,...

    ElevateX 2026, Marking a New Chapter in Human Centric and Intelligent Automation

    Teradyne Robotics today hosted ElevateX 2026 in Bengaluru -...

    The Architecture of Edge Computing Hardware: Why Latency, Power and Data Movement Decide Everything

    Courtesy: Ambient Scientific Most explanations of edge computing hardware talk...

    Govt Bets Big on Chips: India Semiconductor Mission 2.0 Gets ₹1,000 Crore Funding

    In a significant push for the nation’s tech ambitions,...

    Microchip and Hyundai Collaborate, Exploring 10BASE-T1S SPE for Future Automotive Connectivity 

    Microchip Technology announced a collaboration with Hyundai Motor Group...

    The Grid as Strategy: Powering India’s 2047 Transformation

    by Varun Bhatia, Vice President – Projects and Learning...

    Engineering the Future of High-Voltage Battery Management: Rohit Bhan on BMIC Innovation

    ELE Times conducts an exclusive interview with Rohit Bhan,...