HomeNewsIndia NewsDiscovering the latest TVS Diode arrays for protecting Ultra-high speed interfaces from...

    Discovering the latest TVS Diode arrays for protecting Ultra-high speed interfaces from ESD

    Littelfuse, Inc. introduced two series of bidirectional TVS Diode Arrays (SPA Diodes) designed to protect ultra-high speed consumer electronics interfaces from damaging electrostatic discharge (ESD) in applications where PCB layout is especially challenging. The SP3208-01UTG, the first TVS Diode Array in the SP3208 Series, is mechanically optimized to deliver consistently ultra-low capacitance (nominally 0.08 pF). The SP3213-01UTG, the first SP3213 Series device, offers an option for highly cost-conscious ESD protection solutions.

    Both of these “Ultimate Ultra-Low Capacitance ESD Protection” devices are AEC-Q101-qualified, employ the same base die, and can safely absorb repetitive ESD strikes at ±12 kV without performance degradation and dissipate 2 A of 8/20 μs surge current.

    Typical applications for SP3208 and SP3213 Series TVS Diode Arrays include:

    • Ultra-high speed data lines and interfaces, such as USB 3.2, 3.1, 3.0, 2.0, HDMI 2.1. 2.0, 1.4a, 1.3, DisplayPort, Thunderbolt and V-by-One®,
    • Low power antenna ports,
    • Consumer, mobile and portable electronics, and
    • Tablet PCs and external storage with high speed interfaces.

    “Rising data rate speeds present significant challenges to design engineers who need to maintain high signal integrity,” said Tim Micun, Business Development Manager, TVS Diode Arrays (SPA Diodes) at Littelfuse. “Compared to other ESD protection solutions on the market, the SP3208 and SP3213 Series provide 50 percent lower nominal capacitance, which helps preserve signal integrity and minimize data loss. Providing a passband in excess of 30 GHz allows signal integrity engineers to create a high speed, data capable environment.”

    SP3208 and SP3213 Series TVS Diode Arrays offer these key benefits:

    • Sub-0.1 pF silicon-based ESD protection allows for passbands as high as 30 GHz, enabling high signal integrity for the world’s fastest data interfaces.
    • Industry-standard 0201DFN packaging with internal construction enhancements reduce parasitic capacitance, inductance, and resistance, making these TVS Diode Arrays easier to model into a protection scheme.
    • Lower parasitic capacitance and inductance permit better dynamic resistance performance, protecting the circuit faster and better.

    Availability
    SP3208 and SP3213 Series TVS Diode Arrays are available in surface-mount µDFN-2 (0201) packages in tape and reel format in quantities of 15,000. Sample requests may be placed through authorized Littelfuse distributors worldwide.

    For more information, visit: Littelfuse.com

    ELE Times Research Desk
    ELE Times Research Deskhttps://www.eletimes.ai
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    LEAVE A REPLY

    Please enter your comment!
    Please enter your name here

    Related News

    Must Read

    Decision Tree Learning Architecture Definition, Types and Diagram

    Decision Tree Learning's architecture is a tree-like, hierarchical structure...

    Top 10 Reinforcement Learning Applications and Use Cases

    One of the most intriguing areas of machine learning...

    How TVS Electronics is Transforming Digital India with “Make in India” AIDC

    In the fast-paced world of digital transformation, Automatic Identification...

    Lotus Microsystems and EDOM Technology Form Strategic Distribution Partnership to Expand Presence Across APAC

    Distribution Partnership to Expand Presence Across APAC Lotus Microsystems ApS,...

    Tata–Merck MoU to Accelerate Chip Manufacturing Infrastructure in India

    Tata Electronics Private Limited has signed a strategic Memorandum...

    UP Electronics Policy Draft to Boost Smartphone and Electronics Manufacturing

    The Uttar Pradesh government has introduced a draft policy...

    Semicon India 2025: PM Modi Says India’s Semiconductor Revolution Will Shape Global Future

    Prime Minister Narendra Modi inaugurated Semicon India 2025, positioning...

    Career Opportunities for Women in India’s Electronics Industry

    In the heart of India’s rapidly transforming digital economy,...