Semiconductors and Chips

Advanced GAA Chips: Minimizing Voltage Loss and Improving Yield

Courtesy: Lam Research As advanced logic chips decrease in size, voltage loss can increase An emerging solution is backside power delivery networks that use...

CEA-Leti & STMicroelectronics’ Demonstrate Path to Fully Monolithic Silicon RF Front-Ends with 3D Sequential Integration...

CEA-Leti and STMicroelectronics showcased key enablers for a new high-performance and versatile RF Si platform cointegrating best-in-class active and passive devices used in RF...

Beyond the Bill: How AI-Enabled Smart Meters Are Driving Lead Time Optimization and Supply Chain...

Introduction Smart meters have significantly evolved since their initial implementation for consumer billing. In the contemporary networked industrial landscape, where semiconductor fabrication facilities, data centers,...

Inside the Digital Twin: How AI is Building Virtual Fabs to Prevent Trillion-Dollar Mistakes

Introduction Semiconductor manufacturing often feels like modern alchemy: billions of tiny transistors squeezed onto a chip smaller than a fingernail, stitched through thousands of precise...

STMicroelectronics streamlines smart-home device integration with industry-first Matter NFC chip

STMicroelectronics has unveiled a secure NFC chip designed to make home networks faster and easier to install and scale, leveraging the latest Matter smart-home...

Mitsubishi Electric India to Showcase Breakthrough Power Semiconductor Technologies at PCIM India 2025

Mitsubishi Electric India, is set to introduce its flagship cutting edge Power Semiconductor Devices and technology to the Indian market. MEI Participation in PCIM...

Overcoming BEOL Patterning Challenges at the 3-NM Node

Courtesy: Lam Research ● Controlling critical process parameters is key to managing edge placement error (EPE) ● Simulations revealed that only 9.75% of runs met the...

7 Challenges Facing Fab Operations and How Providers Can Solve Them

Courtesy: Monikantan Ayyasamy, General Manager, Equipment Engineering & Supply Chain Management at Orbit & Skyline Semiconductor manufacturing facilities, or fabs, are some of the most...

Caliber Interconnects Accelerates Complex Chiplet and ATE Hardware Design with Cadence Allegro X and Sigrity X Solutions

Caliber Interconnects Pvt. Ltd., announced that it has achieved accelerated turnaround times and first-time-right outcomes for complex chiplet and Automated Test Equipment (ATE) hardware...

Infineon’s new MOTIX system-on-chip family for motor control enables compact and cost-efficient designs

Infineon Technologies is expanding its MOTIX 32-bit motor control SoC (System-on-chip) family with new solutions for both brushed (BDC) and brushless (BLDC) motor applications:...

From Monoliths to Modules: A story of heterogeneous integration, chiplets, and the industry reshaping itself

For nearly four decades, the semiconductor narrative has simply revolved around Moore’s Law, shrinking transistors, packing more logic onto a single die for achieving...

TI’s new power-management solutions enable scalable AI infrastructures

Texas Instruments (TI) debuted new design resources and power-management chips to help companies meet growing artificial intelligence (AI) computing demands and scale power-management architectures...

Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure

Switchtec Gen 6 PCIe Fanout Switches deliver extra bandwidth, low latency and advanced security for high-performance compute, cloud computing and hyperscale data centers As artificial...

Nuvoton Launches Arbel NPCM8mnx System-in-Package (SiP) for AI Servers and Datacenter Infrastructure

Breakthrough BMC Innovation Powers Secure, Scalable, and Open Compute Platforms Nuvoton Technology Corporation announced the launch of the Arbel NPCM8mnx System-in-Package (SiP) — a compact,...

IEEE IEDM, 2025 Showcases Latest Technologies in Microelectronics, Themed “100 Years of FETs”

The IEEE International Electron Devices Meeting (IEDM) is considered the premier forum where scientists and engineers come together to disclose, discuss, and debate the...

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