HomeNewsIndia NewsElement14 introduces Molex SL Wire-to-Wire Modular Connector System for communications and industrial...

    Element14 introduces Molex SL Wire-to-Wire Modular Connector System for communications and industrial applications

    element14 has expanded its range of Molex SL (Stackable Linear) Modular Connectors, comprising the largest number of variations and cabling configurations, to now include CPA and TPA locking options. The range is suited for low-power and signal Wire-to-Board, Wire-to-Wire applications for communications, industrial, medical, consumer electronics, and automotive industries.

    Molex has strengthened their offering with a range of crimp housings to the SL Wire-to-Wire Modular Connector System, with benefits that include additional terminal position assurance (TPA) and connector position assurance (CPA) locking features, providing design flexibility for applications used in high-vibration environments.

    The new range of Molex SL (Stackable Linear) Modular Connectors is available from Newark element14 in North America, Farnell element14 in Europe and element14 in APAC

    The new range of Molex SL  (Stackable Linear) Modular Connectors is available from Newark element14 in North America, Farnell element14 in Europe and element14 in APAC

    The full range of Molex’s Wire-to-Board and Wire-to-Wire SL  Modular Connector System is available at  http://in.element14.com/Molex_SL_Modular

    ELE Times Bureau
    ELE Times Bureauhttps://www.eletimes.ai/
    ELE Times provides a comprehensive global coverage of Electronics, Technology and the Market. In addition to providing in depth articles, ELE Times attracts the industry’s largest, qualified and highly engaged audiences, who appreciate our timely, relevant content and popular formats. ELE Times helps you build awareness, drive traffic, communicate your offerings to right audience, generate leads and sell your products better.

    Related News

    Must Read

    AI Glasses: Ushering in the Next Generation of Advanced Wearable Technology

    Courtesy: NXP Semiconductors   AI integration into wearable technology is...

    The semiconductor technology shaping the autonomous driving experience

    Courtesy: Texas Instruments Last summer in Italy, I held...

    The electronics Industry in 2026 and Beyond: A Strategic Crossroads

    As we stand on the threshold of 2026, the...

    Keysight & Samsung: Industry-First NR-NTN S-Band & Satellite Mobility Success

    Keysight Technologies announced a groundbreaking end-to-end live new radio non-terrestrial...

    Quantum Technology 2.0: Road to Transformation

    Courtesy: Rhode & Schwarz After more than 100 years of...

    Develop Highly Efficient X-in-1 Integrated Systems for EVs

    Courtesy: Renesas The recent tightening of CO2 emission regulations has...

    Cadence to deliver pre-validated chiplet solutions to Accelerate Chiplet Time to Market

    Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce...

    Microchip Releases Custom Firmware For NVIDIA DGX Spark For Its MEC1723 Embedded Controllers

    Microchip Technology announced the release of custom-designed firmware for...

    Infineon and HL Klemove collaborate to advance innovation for SDVs

    Infineon Technologies AG and HL Klemove aim to strengthen...